公开(公告)号：US20240049434A1

公开(公告)日：2024-02-08

申请号：US18378226

申请日：2023-10-10

申请人： Ciena Corporation

发明人： Behzad Mohajer ,  Terence Graham ,  Peter Ajersch ,  Bonnie L. Mack ,  Marko Nicolici ,  Michael Bishop ,  Kamran Rahmani ,  Simon J. Shearman ,  Daniel Rivaud

IPC分类号： H05K7/20

CPC分类号： H05K7/20636 ,  H05K7/20563 ,  H05K7/20254

摘要： A network element include one or more modules each supporting one or more pluggable modules; and a first manifold and a second manifold each configured to connect to a conduit associated with a coldplate, wherein one of the first manifold and the second manifold is an inlet manifold and the other is an outlet manifold for a cooling fluid that flows through the conduit to cool the one or more pluggable modules. The one or more pluggable modules can be each a pluggable optical module that is one of compliant to any of XFP, SFP, XENPAK, X2, CFP, CFP2, CFP4, CFP8, QSFP, QSFP+, QSFP28, OSFP, and QSFP-DD and have a housing that has dimensions similar to any of XFP, SFP, XENPAK, X2, CFP, CFP2, CFP4, CFP8, QSFP, QSFP+, QSFP28, OSFP, and QSFP-DD.

公开(公告)号：US20230039781A1

公开(公告)日：2023-02-09

申请号：US17941140

申请日：2022-09-09

申请人： Ciena Corporation

发明人： Behzad Mohajer ,  Terence Graham ,  Peter Ajersch ,  Bonnie L. Mack ,  Marko Nicolici ,  Michael Bishop ,  Kamran Rahmani ,  Simon J. Shearman ,  Daniel Rivaud

IPC分类号： H05K7/20

摘要： A network element include one or more modules each supporting one or more pluggable modules; and a first manifold and a second manifold each configured to connect to a conduit associated with a coldplate, wherein one of the first manifold and the second manifold is an inlet manifold and the other is an outlet manifold for a cooling fluid that flows through the conduit to cool the one or more pluggable modules. The one or more pluggable modules can be each a pluggable optical module that is one of compliant to any of XFP, SFP, XENPAK, X2, CFP, CFP2, CFP4, CFP8, QSFP, QSFP+, QSFP28, OSFP, and QSFP-DD and have a housing that has dimensions similar to any of XFP, SFP, XENPAK, X2, CFP, CFP2, CFP4, CFP8, QSFP, QSFP+, QSFP28, OSFP, and QSFP-DD.

公开(公告)号：US20240276668A1

公开(公告)日：2024-08-15

申请号：US18643385

申请日：2024-04-23

申请人： Ciena Corporation

发明人： Mitchell O’Leary ,  Bonnie L. Mack ,  Trevor Meunier

IPC分类号： H05K7/14

CPC分类号： H05K7/142 ,  H05K7/1427

摘要： A sprung frame assembly that can accommodate varying tolerance device heights while still exerting sufficient pressure/force required to a heatsink to contact and cool a bare die device, or other device of the like. Adapted for space constrained modules where placement of mounting holes is limited, and module density is high. Sprung frames are secured to mounting points at available locations on support structures as to eliminate any mounting holes in the PCB. The required force/pressure can be evenly achieved by methodically tightening a plurality of screws with springs at the corners of the sprung frames in sequence, pressure is applied evenly without damaging the device, while also taking up any tolerances in the device height.

公开(公告)号：US20230180419A1

公开(公告)日：2023-06-08

申请号：US17545025

申请日：2021-12-08

申请人： Ciena Corporation

发明人： Mitchell O'Leary ,  Bonnie L. Mack ,  Trevor Meunier

IPC分类号： H05K7/14

CPC分类号： H05K7/142 ,  H05K7/1427

摘要： A sprung frame assembly that can accommodate varying tolerance device heights while still exerting sufficient pressure/force required to a heatsink to contact and cool a bare die device, or other device of the like. Adapted for space constrained modules where placement of mounting holes is limited, and module density is high. Sprung frames are secured to mounting points at available locations on support structures as to eliminate any mounting holes in the PCB. The required force/pressure can be evenly achieved by methodically tightening a plurality of screws with springs at the corners of the sprung frames in sequence, pressure is applied evenly without damaging the device, while also taking up any tolerances in the device height.

公开(公告)号：US11997817B2

公开(公告)日：2024-05-28

申请号：US17545025

申请日：2021-12-08

申请人： Ciena Corporation

发明人： Mitchell O'Leary ,  Bonnie L. Mack ,  Trevor Meunier

IPC分类号： H05K7/14

CPC分类号： H05K7/142 ,  H05K7/1427

摘要： A sprung frame assembly that can accommodate varying tolerance device heights while still exerting sufficient pressure/force required to a heatsink to contact and cool a bare die device, or other device of the like. Adapted for space constrained modules where placement of mounting holes is limited, and module density is high. Sprung frames are secured to mounting points at available locations on support structures as to eliminate any mounting holes in the PCB. The required force/pressure can be evenly achieved by methodically tightening a plurality of screws with springs at the corners of the sprung frames in sequence, pressure is applied evenly without damaging the device, while also taking up any tolerances in the device height.

公开(公告)号：US11980009B2

公开(公告)日：2024-05-07

申请号：US17941140

申请日：2022-09-09

申请人： Ciena Corporation

发明人： Behzad Mohajer ,  Terence Graham ,  Peter Ajersch ,  Bonnie L. Mack ,  Marko Nicolici ,  Michael Bishop ,  Kamran Rahmani ,  Simon J. Shearman ,  Daniel Rivaud

IPC分类号： H05K7/20 ,  G02B6/42

CPC分类号： H05K7/20272 ,  H05K7/20254 ,  H05K7/20781 ,  G02B6/4261 ,  G02B6/4268

摘要： A network element include one or more modules each supporting one or more pluggable modules; and a first manifold and a second manifold each configured to connect to a conduit associated with a coldplate, wherein one of the first manifold and the second manifold is an inlet manifold and the other is an outlet manifold for a cooling fluid that flows through the conduit to cool the one or more pluggable modules. The one or more pluggable modules can be each a pluggable optical module that is one of compliant to any of XFP, SFP, XENPAK, X2, CFP, CFP2, CFP4, CFP8, QSFP, QSFP+, QSFP28, OSFP, and QSFP-DD and have a housing that has dimensions similar to any of XFP, SFP, XENPAK, X2, CFP, CFP2, CFP4, CFP8, QSFP, QSFP+, QSFP28, OSFP, and QSFP-DD.

公开(公告)号：US20210112683A1

公开(公告)日：2021-04-15

申请号：US17071073

申请日：2020-10-15

申请人： Ciena Corporation

发明人： Behzad Mohajer ,  Terence Graham ,  Peter Ajersch ,  Bonnie L. Mack ,  Marko Nicolici ,  Michael Bishop ,  Kamran Rahmani ,  Simon J. Sherman

IPC分类号： H05K7/20

摘要： A network element include one or more modules each supporting one or more pluggable modules; and a first manifold and a second manifold each configured to connect to a conduit associated with a coldplate, wherein one of the first manifold and the second manifold is an inlet manifold and the other is an outlet manifold for a cooling fluid that flows through the conduit to cool the one or more pluggable modules. The one or more pluggable modules can be each a pluggable optical module that is one of compliant to any of XFP, SFP, XENPAK, X2, CFP, CFP2, CFP4, CFP8, QSFP, QSFP+, QSFP28, OSFP, and QSFP-DD and have a housing that has dimensions similar to any of XFP, SFP, XENPAK, X2, CFP, CFP2, CFP4, CFP8, QSFP, QSFP+, QSFP28, OSFP, and QSFP-DD.