An electrical connecting device includes a first guide plate having first guide holes through which probes are inserted, a second guide plate having second guide holes through which the probes are inserted, and an introduction film arranged between the first guide plate and the second guide plate and having introduction guide holes through which the probes are inserted. The introduction film is formed from material that is dissolved by a specific solvent that does not dissolve the first guide plate, the second guide plate, and the probes.