ELECTRICAL CONNECTING DEVICE AND METHOD FOR MANUFACTURING ELECTRICAL CONNECTING DEVICE

    公开(公告)号:US20230400481A1

    公开(公告)日:2023-12-14

    申请号:US18249003

    申请日:2021-12-03

    发明人: Satoshi NARITA

    IPC分类号: G01R1/073

    CPC分类号: G01R1/07342

    摘要: An electrical connecting device includes a first guide plate having first guide holes through which probes are inserted, a second guide plate having second guide holes through which the probes are inserted, and an introduction film arranged between the first guide plate and the second guide plate and having introduction guide holes through which the probes are inserted. The introduction film is formed from material that is dissolved by a specific solvent that does not dissolve the first guide plate, the second guide plate, and the probes.

    PROBE ASSEMBLY, PROBE CARD INCLUDING THE SAME, AND METHODS FOR MANUFACTURING THESE
    2.
    发明申请
    PROBE ASSEMBLY, PROBE CARD INCLUDING THE SAME, AND METHODS FOR MANUFACTURING THESE 有权
    探针组件,包括其的探针卡及其制造方法

    公开(公告)号:US20130154682A1

    公开(公告)日:2013-06-20

    申请号:US13719161

    申请日:2012-12-18

    IPC分类号: G01R1/073 H05K13/00

    摘要: Quality of connection portions between respective probes and respective wires in a probe assembly is improved. Also, time required for work for connection between the probes and the wires is shortened. Further, improper connection between the probes and the wires is eliminated. A probe assembly includes an electric insulating substrate, a plurality of probes supported on one surface of the substrate, a plurality of through holes provided in the substrate to respectively correspond to the plurality of probes and filled with a conductive material attached to the respective probes, and a plurality of conductive membranes formed on the other surface of the substrate and respectively attached to the conductive material in the plurality of through holes.

    摘要翻译: 提高了探针组件中相应探针和相应电线之间的连接部分的质量。 此外,缩短了探针和电线之间的连接工作所需的时间。 此外,消除了探针和电线之间的不正确连接。 探针组件包括电绝缘基板,支撑在基板的一个表面上的多个探针,多个通孔,设置在基板中,分别对应于多个探针,并填充有连接到各个探针的导电材料, 以及多个导电膜,其形成在所述基板的另一个表面上,并分别安装在所述多个通孔中的所述导电材料上。