- 专利标题: SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME
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申请号: US18360471申请日: 2023-07-27
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公开(公告)号: US20230402543A1公开(公告)日: 2023-12-14
- 发明人: Sai-Hooi YEONG , Chi-On CHUI , Chien-Ning YAO
- 申请人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 申请人地址: TW Hsinchu
- 专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人地址: TW Hsinchu
- 分案原申请号: US16990295 2020.08.11
- 主分类号: H01L29/78
- IPC分类号: H01L29/78 ; H01L21/28 ; H01L29/66 ; H01L21/8234 ; H01L29/06 ; H01L29/417
摘要:
A semiconductor device structure is provided. The semiconductor device structure includes a transistor which includes a source/drain feature adjoining an active region, and a gate stack over the active region. The semiconductor device structure further includes a capacitor above the transistor, the capacitor including a bottom electrode layer on the gate stack and a ferroelectric layer on the bottom electrode layer. The ferroelectric layer is made of a Hf-based dielectric material. The semiconductor device structure further includes gate spacer layers surrounding the gate stack, the bottom electrode layer and the ferroelectric layer.
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