发明公开
- 专利标题: SEMICONDUCTOR DEVICES
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申请号: US18110950申请日: 2023-02-17
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公开(公告)号: US20230420519A1公开(公告)日: 2023-12-28
- 发明人: Da Hye Kim , Gyeom Kim , Jin Bum Kim , Su Jin Jung , Kyung Bin Chun
- 申请人: Samsung Electronics Co., Ltd.
- 申请人地址: KR Suwon-si
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR Suwon-si
- 优先权: KR 20220075952 2022.06.22
- 主分类号: H01L29/08
- IPC分类号: H01L29/08 ; H01L29/06 ; H01L29/161 ; H01L29/423 ; H01L29/775 ; H01L21/02 ; H01L29/66
摘要:
A semiconductor device having improved performance and reliability. The semiconductor device may include a lower pattern extending in a first direction, and a plurality of sheet patterns spaced apart from the lower pattern in a second direction perpendicular to the first direction. A plurality of gate structures may be on the lower pattern and spaced apart in the first direction, and a source/drain pattern, which may include a semiconductor liner film and a semiconductor filling film on the semiconductor liner film. A liner recess that is defined by an inner surface of the semiconductor liner film may include a plurality of width extension regions, and a width of each width extension region in the first direction may increase and then decreases, as a distance increases in the second direction from an upper surface of the lower pattern.
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