- 专利标题: MULTILAYER ELECTRONIC COMPONENT
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申请号: US17971914申请日: 2022-10-24
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公开(公告)号: US20230066593A1公开(公告)日: 2023-03-02
- 发明人: Jae Seok YI , Il Ro LEE , Chang Hak CHOI , Bon Seok KOO , Jung Min KIM , Byung Woo KANG , San KYEONG
- 申请人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 申请人地址: KR Suwon-si
- 专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址: KR Suwon-si
- 优先权: KR10-2019-0169536 20191218
- 主分类号: H01G4/30
- IPC分类号: H01G4/30 ; H01G4/12 ; H01G2/06 ; H01G4/012 ; H01G4/008
摘要:
A multilayer electronic component include a first non-conductive resin layer, extending between a conductive resin layer and an electrode layer of a first external electrode, and a second non-conductive resin layer extending between a conductive resin layer and an electrode layer of a second external electrode. The first non-conductive layer and the second non-conductive layer may be spaced apart from each other to suppress arc discharge and to improve bending strength.
公开/授权文献
- US11798747B2 Multilayer electronic component 公开/授权日:2023-10-24
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