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公开(公告)号：US20230170147A1
公开(公告)日：2023-06-01
申请号：US17665462
申请日：2022-02-04
发明人： Hye Jin PARK , Bon Seok KOO , Jung Min KIM , Hong Je CHOI , Byung Woo KANG , Ji Hye HAN , Sang Wook LEE
摘要： A multilayer electronic component includes: a body including a dielectric layer and a plurality of internal electrodes stacked on each other interposing the dielectric layer therebetween, and external electrodes respectively disposed on the body, wherein the external electrode includes: a first electrode layer connected to the internal electrode; and a second electrode layer disposed on the first electrode layer, and including a conductive portion including an silver (Ag)-tin (Sn) alloy and a resin, and a ratio of an area of the Ag—Sn alloy to an area of the conductive portion satisfies 3 to 50% in at least a portion of a cross-section of the second electrode layer.
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公开(公告)号：US20230119122A1
公开(公告)日：2023-04-20
申请号：US17682023
申请日：2022-02-28
发明人： Ji Hye HAN , Jung Min KIM , Byung Woo KANG , Hong Je CHOI , Hye Jin PARK , Sang Wook LEE , Bon Seok KOO , Jung Won LEE
摘要： A multilayer electronic component includes a body including a dielectric layer and an internal electrode, and an external electrode disposed on the body. The external electrode includes an electrode layer connected to the internal electrode, an intermetallic compound layer disposed on the electrode layer and including a first intermetallic compound and glass, and a conductive resin layer disposed on the intermetallic compound layer and including a conductive connection portion including a second intermetallic compound and a low-melting-point metal, a plurality of metal particles, and a resin. A ratio of a length of a first direction component of a region having the first intermetallic compound, with respect to a length of a first direction component of the intermetallic compound layer, is 20% or more.
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公开(公告)号：US20220262571A1
公开(公告)日：2022-08-18
申请号：US17733068
申请日：2022-04-29
发明人： Jae Seok YI , Jung Min KIM , Bon Seok KOO , Chang Hak CHOI , Il Ro LEE , Byung Woo KANG , San KYEONG , Hae Sol KANG
摘要： A multilayer electronic component has a body and a non-conductive resin layer. The non-conductive resin layer includes a body cover portion disposed in a region of an external surface of the body in which an electrode layer of an external electrode is not disposed, and an extending portion extending from the body cover portion between the electrode layer and a conductive resin layer of the external electrode, to thereby suppress arc discharge, improve bending strength, and improve moisture resistance.
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公开(公告)号：US20210074481A1
公开(公告)日：2021-03-11
申请号：US16834346
申请日：2020-03-30
发明人： Jae Seok YI , Jung Min KIM , Bon Seok KOO , Chang Hak CHOI , Il Ro LEE , Byung Woo KANG , San KYEONG , Hae Sol KANG
摘要： A multilayer electronic component has a body and a non-conductive resin layer. The non-conductive resin layer includes a body cover portion disposed in a region of an external surface of the body in which an electrode layer of an external electrode is not disposed, and an extending portion extending from the body cover portion between the electrode layer and a conductive resin layer of the external electrode, to thereby suppress arc discharge, improve bending strength, and improve moisture resistance.
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公开(公告)号：US20170301468A1
公开(公告)日：2017-10-19
申请号：US15450409
申请日：2017-03-06
发明人： Jung Min KIM , Bon Seok KOO , Jung Wook SEO , Yoon Hee LEE , Kun Hoi KOO
CPC分类号： H01G4/2325 , H01G4/12 , H01G4/232 , H01G4/30
摘要： A multilayer capacitor and a method of manufacturing includes a conductive resin layer of an external electrode disposed on a first electrode layer. The conductive resin layer includes a conductive connecting part and an intermetallic compound contacting the first electrode layer and the conductive connecting part. The conductive connecting part contacts a plurality of metal particles and a second electrode layer, such that the 7equivalent series resistance (ESR) of the multilayer capacitor is decreased and warpage strength of the multilayer capacitor is improved.
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公开(公告)号：US20240213509A1
公开(公告)日：2024-06-27
申请号：US18204534
申请日：2023-06-01
发明人： Sung Han KIM , Jong Ho CHUNG , Jung Ho SHIM , Jae Hyuk JANG , Bon Seok KOO , Hong Ryul LEE
IPC分类号： H01M8/1233 , H01M8/0273 , H01M8/04007 , H01M8/2432 , H01M8/2484
CPC分类号： H01M8/1233 , H01M8/0273 , H01M8/04067 , H01M8/2432 , H01M8/2484 , H01M2008/1293
摘要： A solid oxide cell stack includes a first end plate having a flow path, a solid oxide cell disposed on the first end plate, and a second end plate including a lower region disposed on the solid oxide cell and having a first through-hole, and an upper region disposed on the lower region and having a second through-hole. In the second end plate, an inner sidewall of the upper region forming the second through-hole is inclined such that a width of the second through-hole increases in an upward direction.
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公开(公告)号：US20230066593A1
公开(公告)日：2023-03-02
申请号：US17971914
申请日：2022-10-24
发明人： Jae Seok YI , Il Ro LEE , Chang Hak CHOI , Bon Seok KOO , Jung Min KIM , Byung Woo KANG , San KYEONG
摘要： A multilayer electronic component include a first non-conductive resin layer, extending between a conductive resin layer and an electrode layer of a first external electrode, and a second non-conductive resin layer extending between a conductive resin layer and an electrode layer of a second external electrode. The first non-conductive layer and the second non-conductive layer may be spaced apart from each other to suppress arc discharge and to improve bending strength.
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公开(公告)号：US20220037087A1
公开(公告)日：2022-02-03
申请号：US17505377
申请日：2021-10-19
发明人： Jae Seok YI , Jung Min KIM , Chang Hak CHOI , Bon Seok KOO , Byung Woo KANG , Hae Sol KANG , San KYEONG , Jun Hyeon KIM
摘要： A multilayered capacitor includes a shock absorbing layer disposed between an upper layer of a capacitor body and a conductive resin layer of an external electrode and between a lower layer of the capacitor body and the conductive resin layer of the external electrode. A length of the shock absorbing layer is longer than that of the conductive resin layer, thereby improving warpage strength characteristics of the capacitor body.
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公开(公告)号：US20200273621A1
公开(公告)日：2020-08-27
申请号：US16537847
申请日：2019-08-12
发明人： Jae Seok YI , Jung Min KIM , Chang Hak CHOI , Bon Seok KOO , Byung Woo KANG , Hae Sol KANG , San KYEONG , Jun Hyeon KIM
摘要： A multilayered capacitor includes a shock absorbing layer disposed between an upper layer of a capacitor body and a conductive resin layer of an external electrode and between a lower layer of the capacitor body and the conductive resin layer of the external electrode. A length of the shock absorbing layer is longer than that of the conductive resin layer, thereby improving warpage strength characteristics of the capacitor body.
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公开(公告)号：US20180286594A1
公开(公告)日：2018-10-04
申请号：US15661146
申请日：2017-07-27
发明人： Jung Min KIM , Bon Seok KOO , Chang Hak CHOI , Hae Sol KANG , Ji Hye HAN , Byung Woo KANG
摘要： A multilayer capacitor may have a decreased equivalent series resistance (ESR) and improved warpage strength and reliability with conductive resin layers of external electrodes on surfaces where internal electrodes are exposed from a body, intermetallic compounds are in contact with conductive connecting portions of the conductive resin layers and the internal electrodes, and conductive connecting portions are in contact with a plurality of metal particles and second electrode layers.
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