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公开(公告)号：US20230162923A1
公开(公告)日：2023-05-25
申请号：US18094668
申请日：2023-01-09
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jae Seok YI , Jung Min KIM , Bon Seok KOO , Chang Hak CHOI , Il Ro LEE , Byung Woo KANG , San KYEONG , Hae Sol KANG
CPC classification number: H01G4/30 , H01G4/1218 , H01G2/02 , H01G4/008 , H01G4/012
Abstract: A multilayer electronic component has a body and a non-conductive resin layer. The non-conductive resin layer includes a body cover portion disposed in a region of an external surface of the body in which an electrode layer of an external electrode is not disposed, and an extending portion extending from the body cover portion between the electrode layer and a conductive resin layer of the external electrode, to thereby suppress arc discharge, improve bending strength, and improve moisture resistance.
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公开(公告)号：US20240178408A1
公开(公告)日：2024-05-30
申请号：US18220993
申请日：2023-07-12
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jung Deok PARK , Hong Ryul LEE , Jae Seok YI
IPC: H01M4/90
CPC classification number: H01M4/9033 , H01M2008/1293
Abstract: A solid oxide cell includes a fuel electrode, an air electrode, and an electrolyte disposed between the fuel electrode and the air electrode, wherein the air electrode includes an ion-electron conductor and an ion conductor, and the ion-electron conductor comprises a compound represented by ABO3, where A includes La, and B includes Sc and at least one of Fe, Mn or Co.
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公开(公告)号：US20220262571A1
公开(公告)日：2022-08-18
申请号：US17733068
申请日：2022-04-29
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jae Seok YI , Jung Min KIM , Bon Seok KOO , Chang Hak CHOI , Il Ro LEE , Byung Woo KANG , San KYEONG , Hae Sol KANG
Abstract: A multilayer electronic component has a body and a non-conductive resin layer. The non-conductive resin layer includes a body cover portion disposed in a region of an external surface of the body in which an electrode layer of an external electrode is not disposed, and an extending portion extending from the body cover portion between the electrode layer and a conductive resin layer of the external electrode, to thereby suppress arc discharge, improve bending strength, and improve moisture resistance.
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公开(公告)号：US20210074481A1
公开(公告)日：2021-03-11
申请号：US16834346
申请日：2020-03-30
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jae Seok YI , Jung Min KIM , Bon Seok KOO , Chang Hak CHOI , Il Ro LEE , Byung Woo KANG , San KYEONG , Hae Sol KANG
Abstract: A multilayer electronic component has a body and a non-conductive resin layer. The non-conductive resin layer includes a body cover portion disposed in a region of an external surface of the body in which an electrode layer of an external electrode is not disposed, and an extending portion extending from the body cover portion between the electrode layer and a conductive resin layer of the external electrode, to thereby suppress arc discharge, improve bending strength, and improve moisture resistance.
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公开(公告)号：US20240186070A1
公开(公告)日：2024-06-06
申请号：US18440863
申请日：2024-02-13
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jae Seok YI , Jung Min KIM , Bon Seok KOO , Chang Hak CHOI , Il Ro LEE , Byung Woo KANG , San KYEONG , Hae Sol KANG
CPC classification number: H01G4/30 , H01G2/02 , H01G4/008 , H01G4/012 , H01G4/1218
Abstract: A multilayer electronic component has a body and a non-conductive resin layer. The non-conductive resin layer includes a body cover portion disposed in a region of an external surface of the body in which an electrode layer of an external electrode is not disposed, and an extending portion extending from the body cover portion between the electrode layer and a conductive resin layer of the external electrode, to thereby suppress arc discharge, improve bending strength, and improve moisture resistance.
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Patent Agency Ranking
公开(公告)号：US20220093337A1
公开(公告)日：2022-03-24
申请号：US17233235
申请日：2021-04-16
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Ji Hye HAN , Jung Min KIM , Jae Seok YI , Hye Jin PARK , Byung Woo KANG , Jeong Ryeol KIM , Bon Seok KOO , Il Ro LEE
Abstract: A multilayer capacitor includes a capacitor body including first to six surfaces, and including a dielectric layer, first and second internal electrodes, and first and second external electrodes. The first and second external electrodes include first and second sintered layers, and first and second plating layers, respectively. An insulating layer is disposed on the capacitor body, to cover an end portion of a first band portion of the first sintered layer and an end portion of a second band portion of the second sintered layer, and has a maximum thickness of 10 μm or more. A portion of the first band portion of the first sintered layer is exposed from the insulating layer. A portion of the second band portion of the second sintered layer is exposed from the insulating layer.
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公开(公告)号：US20210193391A1
公开(公告)日：2021-06-24
申请号：US16857264
申请日：2020-04-24
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jae Seok YI , Il Ro LEE , Chang Hak CHOI , Bon Seok KOO , Jung Min KIM , Byung Woo KANG , San KYEONG
Abstract: A multilayer electronic component include a first non-conductive resin layer, extending between a conductive resin layer and an electrode layer of a first external electrode, and a second non-conductive resin layer extending between a conductive resin layer and an electrode layer of a second external electrode. The first non-conductive layer and the second non-conductive layer may be spaced apart from each other to suppress arc discharge and to improve bending strength.
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公开(公告)号：US20230386749A1
公开(公告)日：2023-11-30
申请号：US17969189
申请日：2022-10-19
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Seon Ho PARK , Jae Seok YI , Moon Soo PARK , Chang Hak CHOI
CPC classification number: H01G4/30 , H01G4/1227 , H01G4/012 , H01G4/008
Abstract: A multilayer electronic component includes a body including a plurality of dielectric layers and internal electrodes, external electrodes disposed on the body to be connected to the internal electrodes, and a metal oxide disposed between the body and the external electrodes. The metal oxide includes calcium (Ca), zinc (Zn), and silicon (Si), and further includes at least one selected from the group consisting of barium (Ba), boron (B), and aluminum (Al).
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公开(公告)号：US20230066593A1
公开(公告)日：2023-03-02
申请号：US17971914
申请日：2022-10-24
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jae Seok YI , Il Ro LEE , Chang Hak CHOI , Bon Seok KOO , Jung Min KIM , Byung Woo KANG , San KYEONG
Abstract: A multilayer electronic component include a first non-conductive resin layer, extending between a conductive resin layer and an electrode layer of a first external electrode, and a second non-conductive resin layer extending between a conductive resin layer and an electrode layer of a second external electrode. The first non-conductive layer and the second non-conductive layer may be spaced apart from each other to suppress arc discharge and to improve bending strength.
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公开(公告)号：US20220037087A1
公开(公告)日：2022-02-03
申请号：US17505377
申请日：2021-10-19
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jae Seok YI , Jung Min KIM , Chang Hak CHOI , Bon Seok KOO , Byung Woo KANG , Hae Sol KANG , San KYEONG , Jun Hyeon KIM
Abstract: A multilayered capacitor includes a shock absorbing layer disposed between an upper layer of a capacitor body and a conductive resin layer of an external electrode and between a lower layer of the capacitor body and the conductive resin layer of the external electrode. A length of the shock absorbing layer is longer than that of the conductive resin layer, thereby improving warpage strength characteristics of the capacitor body.
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