Invention Application
- Patent Title: SEMICONDUCTOR ELEMENT, ELECTRONIC SYSTEM INCLUDING THE SEMICONDUCTOR ELEMENT, AND METHOD OF FABRICATING THE SEMICONDUCTOR ELEMENT
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Application No.: US17939303Application Date: 2022-09-07
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Publication No.: US20230072863A1Publication Date: 2023-03-09
- Inventor: Eunkyu LEE , Sangwon KIM , Kyung-Eun BYUN , Yeonchoo CHO
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2021-0119932 20210908
- Main IPC: H01L27/108
- IPC: H01L27/108

Abstract:
A semiconductor element may include a substrate including source and drain regions formed in the substrate apart from each other by a trench, a gate insulating layer covering a bottom surface and a sidewall of the trench, a gate electrode including lower and upper buried portions. The lower buried portion may be in the trench with the gate insulating layer therearound and fill a lower region of the trench. The upper buried portion may be on the lower buried portion with the gate insulating layer therearound and fill an upper region of the trench. The upper buried portion may include a two-dimensional material layer in the trench on an upper surface of the first conductive layer and an upper region of the sidewall of the gate insulating layer, and a second conductive layer in the upper region of the trench and surrounded by the two-dimensional material layer.
Information query
IPC分类: