Invention Application
- Patent Title: SEALING STRUCTURE AND MATERIAL CONTAINING DEVICE INCLUDING THE SAME
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Application No.: US17688418Application Date: 2022-03-07
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Publication No.: US20230089079A1Publication Date: 2023-03-23
- Inventor: Wooram HONG , Hyun Do Choi , Dal Heo , Youngchun Kwon , Hyukju Kwon , Gahee Kim , Bosung Kim , Jeonghun Kim , Jin Woo Kim , Min Sik Park , Youngjin Park , Hyungtae Seo , Won Seok Oh , Dongseon Lee , Sangyoon Lee , Jaejun Chang , Jun-Woon Jang , Hyunjeong Jeon , Joon-Kee Cho , Byung-Kwon Choi , Won Je Choi , Younsuk Choi , Taesin Ha
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2021-0124491 20210917
- Main IPC: B65D51/00
- IPC: B65D51/00 ; B65D51/20

Abstract:
A sealing structure may include a lid including a first lid face, a second lid face opposite to the first lid face, and a fragile area between the first lid face and the second lid face, a cover including a first cover face facing the second lid face and covering the fragile area and a second cover face opposite to the first cover face, wherein a first distance between the second lid face and the first cover face is substantially equal to or less than a second distance between the first cover face and the second cover face, and a connector configured to connect the lid and the cover.
Public/Granted literature
- US12145782B2 Sealing structure and material containing device including the same Public/Granted day:2024-11-19
Information query