公开(公告)号：US12145782B2

公开(公告)日：2024-11-19

申请号：US17688418

申请日：2022-03-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Wooram Hong ,  Hyun Do Choi ,  Dal Heo ,  Youngchun Kwon ,  Hyukju Kwon ,  Gahee Kim ,  Bosung Kim ,  Jeonghun Kim ,  Jin Woo Kim ,  Min Sik Park ,  Youngjin Park ,  Hyungtae Seo ,  Won Seok Oh ,  Dongseon Lee ,  Sangyoon Lee ,  Jaejun Chang ,  Jun-Won Jang ,  Hyunjeong Jeon ,  Joon-Kee Cho ,  Byung-Kwon Choi ,  Won Je Choi ,  Younsuk Choi ,  Taesin Ha

IPC: B65D51/00 ,  B65D51/20

Abstract: A sealing structure may include a lid including a first lid face, a second lid face opposite to the first lid face, and a fragile area between the first lid face and the second lid face, a cover including a first cover face facing the second lid face and covering the fragile area and a second cover face opposite to the first cover face, wherein a first distance between the second lid face and the first cover face is substantially equal to or less than a second distance between the first cover face and the second cover face, and a connector configured to connect the lid and the cover.

公开(公告)号：US12135170B2

公开(公告)日：2024-11-05

申请号：US17888213

申请日：2022-08-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Wooram Hong ,  Hyun Do Choi ,  Dal Heo ,  Youngchun Kwon ,  Hyukju Kwon ,  Gahee Kim ,  Bosung Kim ,  Jeonghun Kim ,  Jin Woo Kim ,  Min Sik Park ,  Youngjin Park ,  Hyungtae Seo ,  Won Seok Oh ,  Dongseon Lee ,  Sangyoon Lee ,  Jaejun Chang ,  Jun-Won Jang ,  Hyunjeong Jeon ,  Joon-Kee Cho ,  Byung-Kwon Choi ,  Won Je Choi ,  Younsuk Choi ,  Taesin Ha

IPC: F28D9/00

Abstract: A heat exchanger is provided. The heat exchanger includes a target area that is a target for heat exchange; and a flow path structure. The flow path structure includes at least one inlet; at least one outlet; a first flow path connected to each of the at least one inlet and the at least one outlet, and extending along a first side of the target area; and a second flow path connected to each of the at least one inlet and the at least one outlet, and extending along a second side, different from the first side, of the target area.

公开(公告)号：US10959001B2

公开(公告)日：2021-03-23

申请号：US16435675

申请日：2019-06-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Gahee Kim ,  Myeongwan Gang ,  Jaeha Park ,  Jungyeol An ,  Gangyoul Kim ,  Juntai Kim ,  Dongmoon Ok ,  Hyunjong Roh ,  Hochul Hwang

IPC: H04R1/04 ,  G06F1/16 ,  G06F3/0354 ,  G06F3/038 ,  H02J7/02 ,  H04R1/40 ,  H04R3/00

Abstract: An electronic device and method are disclosed. The electronic device includes a housing, microphone, wireless communication circuit, processor, memory, and stylus pen. The processor is configured to implement the method, including: when the stylus pen is located in the elongated hole, operate both the at least one first microphone and the second microphone to detect sound, and when the stylus pen is not located in the elongated hole, operate only the first microphone to detect sound.

公开(公告)号：US20230089079A1

公开(公告)日：2023-03-23

申请号：US17688418

申请日：2022-03-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Wooram HONG ,  Hyun Do Choi ,  Dal Heo ,  Youngchun Kwon ,  Hyukju Kwon ,  Gahee Kim ,  Bosung Kim ,  Jeonghun Kim ,  Jin Woo Kim ,  Min Sik Park ,  Youngjin Park ,  Hyungtae Seo ,  Won Seok Oh ,  Dongseon Lee ,  Sangyoon Lee ,  Jaejun Chang ,  Jun-Woon Jang ,  Hyunjeong Jeon ,  Joon-Kee Cho ,  Byung-Kwon Choi ,  Won Je Choi ,  Younsuk Choi ,  Taesin Ha

IPC: B65D51/00 ,  B65D51/20

Abstract: A sealing structure may include a lid including a first lid face, a second lid face opposite to the first lid face, and a fragile area between the first lid face and the second lid face, a cover including a first cover face facing the second lid face and covering the fragile area and a second cover face opposite to the first cover face, wherein a first distance between the second lid face and the first cover face is substantially equal to or less than a second distance between the first cover face and the second cover face, and a connector configured to connect the lid and the cover.

公开(公告)号：US11038212B2

公开(公告)日：2021-06-15

申请号：US15995268

申请日：2018-06-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Changhoon Jung ,  Gahee Kim

IPC: H01M10/42 ,  H01M10/625 ,  B60L58/12 ,  B60L3/12

Abstract: Provided are a module for real-time thermal behavior analysis of a secondary cell battery and a method of operating the module. The module includes a region for mounting a sample battery, a region for mounting a reference battery, and a housing covering the two regions and having an adiabatic characteristic. The region for mounting the sample battery is defined by two partitions facing each other. In addition, the region for mounting the reference battery is defined by two partitions facing each other. The region for mounting the sample battery is a region for vertically or horizontally mounting the sample battery. The region for mounting the reference battery is a region for vertically or horizontally mounting the reference battery.

公开(公告)号：US20160107141A1

公开(公告)日：2016-04-21

申请号：US14884548

申请日：2015-10-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Myoungsoon Kim ,  Gahee Kim ,  Youngwan Ha

IPC: B01J20/286 ,  G01N33/545 ,  B01J20/26

CPC classification number: B01J20/286 ,  B01J20/265 ,  G01N33/545

Abstract: A solid support with a polymer, and a method of using the solid support are provided.

Abstract translation: 提供了具有聚合物的固体支持物和使用固体支持物的方法。