A multilayer circuit board includes an upper surface and an opposing lower surface. An electrically insulating layer is disposed between the upper and lower surfaces. A plurality of electrically conductive upper and lower rear pads are disposed proximate a rear edge on the respective upper and lower surfaces for termination of a plurality of wires. The upper and lower rear pads include respective upper and lower rear ground pads substantially aligned with each other and configured for termination of ground wires. A plurality of electrically conductive front pads are disposed proximate a front edge for insertion into a connector and electrically connected to the upper and lower rear pads. An electrically conductive via extends from the upper rear ground pad to the lower rear ground pad and makes electrical and physical contact with each of the upper and lower rear ground pads.