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公开(公告)号:US20240297450A1
公开(公告)日:2024-09-05
申请号:US18278922
申请日:2022-02-15
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor: Kok Hoe Lee , Saujit Bandhu , YunLong Qriao
CPC classification number: H01R12/714 , H01R12/7047 , H01R12/79 , H01R13/6658
Abstract: A cable assembly is disclosed and includes a plurality of cables, a plurality of terminals, a printed circuit board (PCB), a plurality of cable contact pads defined on the PCB, and a plurality of terminal contact pads defined on the PCB. A first terminal contact pad and a first cable contact pad are in electrical communication with one another and a second terminal contact pad and a second cable contact pad are in electrical communication. The first cable contact pad and the first terminal contact pad are disposed at different locations on the PCB, as measured along a Y axis, and the second cable contact pad and the second terminal contact pad are disposed at different locations on the PCB, as measured along the Y axis.
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公开(公告)号:US20240250484A1
公开(公告)日:2024-07-25
申请号:US18569406
申请日:2022-06-16
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor: Chin Hua Lim , Saujit Bandhu , Kok Hoe Lee , Siang Sin Foo
IPC: H01R13/6594 , H01R12/72 , H01R13/405
CPC classification number: H01R13/6594 , H01R12/722 , H01R13/405
Abstract: An electrical connector configured to mate with a mating connector along a mating direction includes an electrically insulative unitary housing, pluralities of top and bottom contacts, and an electrically conductive unitary shield. The pluralities of top and bottom contacts are disposed in a central slot at a respective top surface and a bottom surface of the central slot for making contact with corresponding conductive terminals of a tongue of the mating connector. The shield is removably assembled to the housing along the mating direction from a rear side of the housing. The shield includes a base shield substantially covering an entire bottom surface of a bottom wall of the housing, and opposing side shields substantially covering opposing side walls of the housing. The shield leaves substantially an entire top surface of a top wall of the housing and the rear side of the housing exposed.
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公开(公告)号:US11276949B2
公开(公告)日:2022-03-15
申请号:US16848039
申请日:2020-04-14
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor: Kok Hoe Lee , Saujit Bandhu , Yunlong Qiao , Rao L. Vittapalli , Chin Hua Lim
IPC: H01R12/72 , H01R13/453 , H01R13/6583 , H01R13/6594
Abstract: In a specific embodiment, a connector 100 is disclosed. The connector 100 comprises an insulative housing 102 defining a rear opening 108 for receiving a plurality of electrical wires 110 and a front opening 106 and a circuit board 104 disposed in the housing 102 and comprising a mating section 112 for mating with a corresponding mating section of a mating connector. The mating section 112 protrudes outwardly from the front opening 106 and terminates at a front edge 118 disposed between opposing side edges 114,116 of the mating section 112. The connector 100 further comprises opposing side arms 128,130 extending forwardly from opposing lateral sides 124,126 of the front opening 106 along, adjacent and beyond corresponding side edges 114,116 of the mating section 112 with a maximum separation between each side edge 114,116 and the corresponding side arm 128,130 being sufficiently small so that when the connector 100 mates with a mating connector, no portion of the mating connector can be inserted between the side edge 114,116 and the corresponding side arm 128,130. Other exemplary embodiments are also disclosed.
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公开(公告)号:US20210296804A1
公开(公告)日:2021-09-23
申请号:US16326457
申请日:2017-09-28
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor: Kok Hoe Lee , Saujit Bandhu , Yunlong Qiao , Rao L. Vittapalli
IPC: H01R12/71 , H01R13/518 , H01R13/6586 , H01R13/24 , H01R13/405 , H01R43/24
Abstract: A connector assembly for mounting on and making solderless electrical contact with a printed circuit board includes a plurality of stacked wafer assemblies. Each wafer assembly includes a wafer, a plurality of terminals partially embedded in the wafer where each terminal includes a connecting portion embedded in the wafer, a resiliently compressible mating portion for making solderless contact with a corresponding conductive pad of a PCB and a contact portion. The wafer is molded over the terminals. The wafer assembly also includes a plurality of wires terminated in termination regions at the contact portions of the terminals, and a shield disposed in the recess of the wafer and extending across the wafer. The connector assembly further includes a housing molded over the stacked wafers and the termination regions.
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公开(公告)号:US10535939B1
公开(公告)日:2020-01-14
申请号:US15998476
申请日:2018-08-15
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor: YunLong Qiao , Saujit Bandhu , Vincent Tan , Kok Hoe Lee
Abstract: A connector assembly including a connector and first and second cables is described. The connector includes an insulative housing and a circuit board partially disposed in the housing. The circuit board includes a mating section and a termination section. The mating section includes a plurality of first contact pads and the termination section includes a plurality of second contact pads electrically connected to the first contact pads. The first and second cables include conductors having front ends terminated at the second contact pads. The housing is overmolded onto and encapsulates at least the front ends of the conductors and the termination section of the circuit board. The circuit board includes a back surface at a rear end of the circuit board and the housing includes a back surface at a cable end of the housing which may be substantially coplanar with the back surface of the circuit board.
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公开(公告)号:US20180076557A1
公开(公告)日:2018-03-15
申请号:US15819006
申请日:2017-11-21
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor: Vincent Tan , Kok Hoe Lee , Rao Vittapalli , Yunlong Qiao , Saujit Bandhu
IPC: H01R13/514 , H01R27/02 , H01R12/71
CPC classification number: H01R13/514 , H01R12/71 , H01R12/72 , H01R27/02 , H01R2107/00
Abstract: An electrical connector includes a unitary base elongated along a longitudinal direction. A first tongue extends forwardly from the base and has a uniform thickness along the longitudinal direction. The first tongue comprises a plurality of spaced apart first contacts. A second tongue extends forwardly from the base and comprises a plurality of spaced apart second contacts. The first and second tongues define a gap therebetween that extends from a front edge of one of the first and second tongues toward the unitary base.
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公开(公告)号:US20170207572A1
公开(公告)日:2017-07-20
申请号:US15473737
申请日:2017-03-30
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor: Kok Hoe Lee , Saujit Bandhu , Dennis L. Doye , YunLong Qiao
IPC: H01R13/58 , H01R12/62 , H01R13/506
CPC classification number: H01R13/5833 , H01R12/62 , H01R13/506 , H01R13/56 , H01R24/60 , H01R2107/00
Abstract: Connector assemblies are disclosed. More particularly, connector assemblies including a housing with an inclined wall are disclosed. The inclined wall helps maintain a folded flat cable by contacting substantially its entire fold edge. The housing with the inclined wall may be removably attached to the rest of the connector assembly.
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公开(公告)号:US20170085042A1
公开(公告)日:2017-03-23
申请号:US15312283
申请日:2015-06-01
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor: YunLong Qiao , Rao L. Vittapalli , Saujit Bandhu , Vincent Tan , Kok Hoe Lee , Chin Hua Lim
CPC classification number: H01R24/62 , H01R12/57 , H01R12/721 , H01R12/727 , H01R12/732 , H01R13/2442 , H01R24/60 , H01R2107/00
Abstract: Electrical connectors are described. More particularly, electrical connectors including a plurality of contacts are described. Both connector plugs and sockets are described. Electrical connectors that are suitable for mounting on a printed circuit board and electrical connectors that include a printed circuit board are described.
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公开(公告)号:US11462845B2
公开(公告)日:2022-10-04
申请号:US16326457
申请日:2017-09-28
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor: Kok Hoe Lee , Saujit Bandhu , Yunlong Qiao , Rao L. Vittapalli
IPC: H01R12/00 , H01R12/71 , H01R13/24 , H01R13/405 , H01R13/518 , H01R13/6586 , H01R43/24
Abstract: A connector assembly for mounting on and making solderless electrical contact with a printed circuit board includes a plurality of stacked wafer assemblies. Each wafer assembly includes a wafer, a plurality of terminals partially embedded in the wafer where each terminal includes a connecting portion embedded in the wafer, a resiliently compressible mating portion for making solderless contact with a corresponding conductive pad of a PCB and a contact portion. The wafer is molded over the terminals. The wafer assembly also includes a plurality of wires terminated in termination regions at the contact portions of the terminals, and a shield disposed in the recess of the wafer and extending across the wafer. The connector assembly further includes a housing molded over the stacked wafers and the termination regions.
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公开(公告)号:US11283218B2
公开(公告)日:2022-03-22
申请号:US16946797
申请日:2020-07-07
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor: YunLong Qiao , Saujit Bandhu , Kok Hoe Lee
IPC: H01R13/633 , H01R13/6592 , H01R13/66 , H05K7/20 , H01R12/79 , H01R13/502 , H01R12/77
Abstract: An electrical connector assembly includes a housing having an upper housing half removably assembled to a lower housing half via a plurality of fasteners. A circuit board is at least partially disposed in a housing cavity formed by the upper and lower housing halves. The circuit board includes a plurality of conductive front and rear pads electrically connected to each other. Flat cables terminate at the conductive rear pads disposed on upper and lower major surfaces of the circuit board. A plurality of alternating ridges and channels is disposed on a top side of the upper housing half, extending along a length of the housing. Bottom surfaces of the channels along a length of the channels are at a same height or higher than uppermost surfaces of the fasteners in the plurality of fasteners. The channels are configured to transfer heat generated by the connector assembly.
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