A module includes: a substrate having a first surface; a first component mounted on the first surface; a first protruding electrode disposed on the first surface; a first resin film covering the first component along a shape of the first component, covering at least a part of the first surface, and partially covering the first protruding electrode; and a first shield film formed to overlap with the first resin film. The first protruding electrode includes a first sharpened portion, the first protruding electrode is exposed from the first resin film in at least a part of the first sharpened portion, and the first shield film is electrically connected to the first protruding electrode by covering a portion where the first protruding electrode is exposed from the first resin film.