公开(公告)号：US20230260929A1

公开(公告)日：2023-08-17

申请号：US18301322

申请日：2023-04-17

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshihito OTSUBO ,  Ryoichi KITA ,  Tsuyoshi TAKAKURA

IPC: H01L23/552 ,  H01L25/16

CPC classification number: H01L23/552 ,  H01L25/16

Abstract: An electronic component module includes a substrate, a plurality of electronic components, an insulating sealing resin, a conductive film, and a conductive chip component. The plurality of electronic components includes an electronic component having a grounding terminal at a side end portion, and are mounted on the main surface of the substrate. The sealing resin covers the plurality of electronic components and the main surface side of the substrate. The conductive film covers the outer surface of the sealing resin. The conductive chip component is disposed on a side of the electronic component opposite to the substrate in a normal direction of the main surface, and is connected to a grounding terminal of the electronic component. The conductive film is connected to the conductive chip component.

公开(公告)号：US20230230907A1

公开(公告)日：2023-07-20

申请号：US18188538

申请日：2023-03-23

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Tsuyoshi TAKAKURA ,  Ryoichi KITA ,  Hideo NAKAGOSHI ,  Hiroki YOSHIMORI ,  Tadashi NOMURA ,  Yoshihito OTSUBO

IPC: H01L23/498 ,  H01L25/18 ,  H01L23/538 ,  H01L23/31 ,  H01L21/56 ,  H01L25/00

CPC classification number: H01L23/49811 ,  H01L25/18 ,  H01L23/5383 ,  H01L23/3157 ,  H01L23/3128 ,  H01L21/56 ,  H01L25/50

Abstract: A substrate structure comprises a substrate having a first surface, a first electrode disposed on the first surface, a bump connected to the first electrode, and a protective member that covers the first surface and covers a portion of the bump. The protective member has an opening. The bump includes a portion exposed through the opening. The bump includes a first portion that is connected to the first electrode, and a second portion that is located farther from the first electrode than the first portion and is connected to the first portion. The bump has a constriction at a boundary between the first portion and the second portion. When viewed in a direction perpendicular to the first surface, a maximum diameter of the second portion is smaller than a maximum diameter of the first portion.

公开(公告)号：US20230100404A1

公开(公告)日：2023-03-30

申请号：US18062048

申请日：2022-12-06

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Tadashi NOMURA ,  Ryoichi KITA

IPC: H05K1/18 ,  H05K9/00

Abstract: A module includes: a substrate having a first surface; a first component mounted on the first surface; a first protruding electrode disposed on the first surface; a first resin film covering the first component along a shape of the first component, covering at least a part of the first surface, and partially covering the first protruding electrode; and a first shield film formed to overlap with the first resin film. The first protruding electrode includes a first sharpened portion, the first protruding electrode is exposed from the first resin film in at least a part of the first sharpened portion, and the first shield film is electrically connected to the first protruding electrode by covering a portion where the first protruding electrode is exposed from the first resin film.

公开(公告)号：US20230015008A1

公开(公告)日：2023-01-19

申请号：US17936051

申请日：2022-09-28

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshihito OTSUBO ,  Ryoichi KITA ,  Tadashi NOMURA

IPC: H05K1/02

Abstract: A module includes: a substrate having a first face; a plurality of components mounted on the first face; a resin film that covers the plurality of components along contours of the plurality of components and also covers a part of the first face; and a shield film formed to overlap the resin film. The first face is provided with a ground electrode. The resin film has an opening, and the shield film is connected to the ground electrode via the opening.