Invention Application
- Patent Title: INTEGRATED CIRCUIT STRUCTURES WITH IMPROVED TWO-DIMENSIONAL CHANNEL ARCHITECTURE
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Application No.: US17485302Application Date: 2021-09-24
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Publication No.: US20230100713A1Publication Date: 2023-03-30
- Inventor: Chelsey DOROW , Kevin P. O'BRIEN , Carl H. NAYLOR , Kirby MAXEY , Sudarat LEE , Ashish Verma PENUMATCHA , Uygar E. AVCI
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L29/24 ; H01L29/06 ; H01L29/423 ; H01L29/45 ; H01L29/786
Abstract:
Embodiments of the disclosure are directed to advanced integrated circuit (IC) structure fabrication and, in particular, IC structures with an improved two-dimensional (2D) channel architecture. Other embodiments may be disclosed or claimed.
Information query
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