- 专利标题: THREE DIMENSIONAL MEMORY DEVICE AND METHOD OF FABRICATION
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申请号: US17868156申请日: 2022-07-19
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公开(公告)号: US20230101155A1公开(公告)日: 2023-03-30
- 发明人: Chang Seok Kang , Fred Fishburn , Tomohiko Kitajima , Sung-Kwan Kang , Sony Varghese , Gill Yong Lee
- 申请人: Applied Materials, Inc.
- 申请人地址: US CA Santa Clara
- 专利权人: Applied Materials, Inc.
- 当前专利权人: Applied Materials, Inc.
- 当前专利权人地址: US CA Santa Clara
- 主分类号: H01L27/108
- IPC分类号: H01L27/108
摘要:
A memory device architecture, and method of fabricating a three dimensional device are provided. The memory device architecture may include a plurality of memory blocks, arranged in an array, wherein a given memory block comprises: a cell region, the cell region comprising a three-dimensional array of memory cells, arranged in a plurality of n memory cell layers; and a staircase region, the staircase region being disposed adjacent to at least a first side of the cell region, the staircase region comprising a signal line assembly that is coupled to the three-dimensional array of memory cells.
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