- 专利标题： Semiconductor Dies and Devices with a Coil for Inductive Coupling
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申请号： US17448734申请日： 2021-09-24
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公开(公告)号： US20230102133A1公开(公告)日： 2023-03-30
- 发明人: Martin OSTERMAYR , Walther LUTZ , Joachim ASSENMACHER , Georg SEIDEMANN
- 申请人： Intel Corporation
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 主分类号： H01L23/64
- IPC分类号： H01L23/64 ; H01L23/00
摘要：
A semiconductor die is disclosed, including circuitry comprising a transistor at a frontside of a semiconductor substrate, and a backside inductor at a backside of the semiconductor substrate. The backside inductor is electrically connected to the transistor of the circuitry.
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