- 专利标题： Semiconductor Device Package Mold Flow Control System and Method
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申请号： US17490279申请日： 2021-09-30
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公开(公告)号： US20230102959A1公开(公告)日： 2023-03-30
- 发明人: Hope Chiu , Hua Tan , Kent Yang , Weiting Jiang , Jerry Tang , Simon Dong , Yuequan Shi , Rosy Zhao
- 申请人： Western Digital Technologies, Inc.
- 申请人地址： US CA San Jose
- 专利权人： Western Digital Technologies, Inc.
- 当前专利权人： Western Digital Technologies, Inc.
- 当前专利权人地址： US CA San Jose
- 主分类号： H01L23/00
- IPC分类号： H01L23/00 ; H01L21/56 ; H01L23/31 ; H01L21/48
摘要：
A semiconductor package includes a substrate having a top planar surface and a semiconductor die mounted on the top planar surface of the substrate. Bond wires electrically connect the semiconductor die to the substrate. Flow control dams are integrally formed with the top planar surface of the substrate and each flow control dam protrudes from the top planar surface of the substrate at a location proximate to the bond wires. The flow control dams reduce the occurrence of wire sweep in the bond wires electrically connected to the substrate and semiconductor die.
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