Invention Application
- Patent Title: SUBSTRATE SUPPORT
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Application No.: US17450418Application Date: 2021-10-08
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Publication No.: US20230114751A1Publication Date: 2023-04-13
- Inventor: Zhepeng CONG , Nyi Oo MYO , Hui CHEN , Huy D. NGUYEN , Shaofeng CHEN , Xinning LUAN , Kirk Allen FISHER , Aimee S. ERHARDT , Shawn Joseph BONHAM , Philip Michael AMOS , James M. AMOS
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Main IPC: C23C16/458
- IPC: C23C16/458

Abstract:
A substrate support assembly and processing chamber having the same are disclosed herein. In one embodiment, a substrate support assembly is provided that includes a body. The body has a center, an outer perimeter connecting a substrate support surface and a backside surface. The body additionally has a pocket disposed on the substrate support surface at the center and a lip disposed between the pocket and the outer perimeter. A layer is formed in the pocket of the substrate support surface. A plurality of discreet islands are disposed in the layer, wherein the discreet islands are disposed about a center line extending perpendicular from the substrate support surface.
Information query
IPC分类: