公开(公告)号：US20230114751A1

公开(公告)日：2023-04-13

申请号：US17450418

申请日：2021-10-08

Applicant: Applied Materials, Inc.

Inventor： Zhepeng CONG ,  Nyi Oo MYO ,  Hui CHEN ,  Huy D. NGUYEN ,  Shaofeng CHEN ,  Xinning LUAN ,  Kirk Allen FISHER ,  Aimee S. ERHARDT ,  Shawn Joseph BONHAM ,  Philip Michael AMOS ,  James M. AMOS

IPC: C23C16/458

Abstract: A substrate support assembly and processing chamber having the same are disclosed herein. In one embodiment, a substrate support assembly is provided that includes a body. The body has a center, an outer perimeter connecting a substrate support surface and a backside surface. The body additionally has a pocket disposed on the substrate support surface at the center and a lip disposed between the pocket and the outer perimeter. A layer is formed in the pocket of the substrate support surface. A plurality of discreet islands are disposed in the layer, wherein the discreet islands are disposed about a center line extending perpendicular from the substrate support surface.

公开(公告)号：US20150380220A1

公开(公告)日：2015-12-31

申请号：US14747367

申请日：2015-06-23

Applicant: Applied Materials, Inc.

Inventor： Tien Fak TAN ,  Dmitry LUBOMIRSKY ,  Kirby H. FLOYD ,  Son T. NGUYEN ,  David PALAGASHVILI ,  Alexander TAM ,  Shaofeng CHEN

IPC: H01J37/32

CPC classification number: H01J37/32724 ,  H01J37/32522 ,  H01J37/32715

Abstract: Implementations of the disclosure generally provide an improved pedestal heater for a processing chamber. The pedestal heater includes a temperature-controlled plate having a first surface and a second surface opposing the first surface. The temperature-controlled plate includes an inner zone comprising a first set of heating elements, an outer zone comprising a second set of heating elements, the outer zone surrounding the inner zone, and a continuous thermal choke disposed between the inner zone and the outer zone, and a substrate receiving plate having a first surface and a second surface opposing the first surface, the second surface of the substrate receiving plate is coupled to the first surface of the temperature-controlled plate. The continuous thermal choke enables a very small temperature gradient to be created and manipulated between the inner zone and the outer zone, allowing center-fast or edge-fast etching profile to achieve on a surface of the substrate.

Abstract translation: 本公开的实施方案通常为处理室提供改进的基座加热器。 基座加热器包括温度控制板，其具有第一表面和与第一表面相对的第二表面。 温度控制板包括内部区域，该内部区域包括第一组加热元件，外部区域包括第二组加热元件，围绕内部区域的外部区域以及设置在内部区域和外部区域之间的连续热扼流圈 以及具有与第一表面相对的第一表面和第二表面的基板接收板，基板接收板的第二表面耦合到温度控制板的第一表面。 连续热扼流圈使得能够在内部区域和外部区域之间产生和操纵非常小的温度梯度，允许在衬底的表面上实现中心快速或边缘快速蚀刻轮廓。

公开(公告)号：US20240304492A1

公开(公告)日：2024-09-12

申请号：US18667082

申请日：2024-05-17

Applicant: Applied Materials, Inc.

Inventor： Hui CHEN ,  Xinning LUAN ,  Kirk Allen FISHER ,  Shawn Joseph BONHAM ,  Aimee S. ERHARDT ,  Zhepeng CONG ,  Shaofeng CHEN ,  Schubert S. CHU ,  James M. AMOS ,  Philip Michael AMOS ,  John NEWMAN

IPC: H01L21/687 ,  C23C16/32 ,  C23C16/458

CPC classification number: H01L21/68757 ,  C23C16/325 ,  C23C16/4583

Abstract: A susceptor for use in a processing chamber for supporting a wafer includes a susceptor substrate having a front side and a back side opposite the front side, and a coating layer deposited on the susceptor substrate. The front side has a pocket configured to hold a wafer to be processed in a processing chamber, the pocket being textured with a first pattern. The back side is textured with a second pattern.

公开(公告)号：US20220076988A1

公开(公告)日：2022-03-10

申请号：US17191786

申请日：2021-03-04

Applicant: Applied Materials, Inc.

Inventor： Hui CHEN ,  Xinning LUAN ,  Kirk Allen FISHER ,  Shawn Joseph BONHAM ,  Aimee S. ERHARDT ,  Zhepeng CONG ,  Shaofeng CHEN ,  Schubert S. CHU ,  James M. AMOS ,  Philip Michael AMOS ,  John NEWMAN

IPC: H01L21/687 ,  C23C16/458 ,  C23C16/32

Abstract: A susceptor for use in a processing chamber for supporting a wafer includes a susceptor substrate having a front side and a back side opposite the front side, and a coating layer deposited on the susceptor substrate. The front side has a pocket configured to hold a wafer to be processed in a processing chamber, the pocket being textured with a first pattern. The back side is textured with a second pattern.