Invention Application
- Patent Title: RFIC ASSEMBLED ANTENNA
-
Application No.: US18047089Application Date: 2022-10-17
-
Publication No.: US20230129616A1Publication Date: 2023-04-27
- Inventor: Byoung Nam KIM , Hong Il YOO , Chul-Keun PARK , Chan-Woo PARK
- Applicant: SENSORVIEW CO., LTD.
- Applicant Address: KR Seongnam-si, Gyeonggi-do
- Assignee: SENSORVIEW CO., LTD.
- Current Assignee: SENSORVIEW CO., LTD.
- Current Assignee Address: KR Seongnam-si, Gyeonggi-do
- Priority: KR10-2021-0141695 20211022,KR10-2022-0012395 20220127
- Main IPC: H01Q1/22
- IPC: H01Q1/22 ; H01Q1/38 ; G06K19/077

Abstract:
An RFIC assembled antenna comprises: a first layer substrate including a first metal pattern, a first slot formed in the first metal pattern, and a second slot formed to be connected to the first slot, and in which an RFIC chip is coupled to a region of the second slot; and a second layer substrate coupled to a lower portion of the first layer substrate and including a second metal pattern, a third slot formed in the second metal pattern, and a dipole radiator formed inside the third slot, wherein a feeding pattern connected to the RFIC chip to provide a feed signal to the dipole radiator is formed inside the first slot.
Public/Granted literature
- US12074360B2 RFIC assembled antenna Public/Granted day:2024-08-27
Information query