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公开(公告)号：US20240006757A1
公开(公告)日：2024-01-04
申请号：US18468955
申请日：2023-09-18
Applicant: SENSORVIEW CO., LTD.
Inventor： Byoung Nam KIM , Chul-Keun PARK , Hong Il YOO
CPC classification number: H01Q1/525 , H01Q9/0407
Abstract: A short-range communication antenna for multi-link communication includes a plurality of radiators each independently set to transmit and receive different signals and having a predetermined array structure, in which each of the plurality of radiators includes: a patch-shaped radiating element; a first parasitic element formed to surround the radiating element; and a second parasitic element formed to surround the first parasitic element, wherein each of the plurality of radiators is rotated +90 degrees or −90 degrees compared to adjacent radiators.
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公开(公告)号：US20230282983A1
公开(公告)日：2023-09-07
申请号：US18171725
申请日：2023-02-21
Applicant: SENSORVIEW CO., LTD.
Inventor： Byoung Nam KIM , Hong Il YOO , Chul-Keun PARK , Chan-Woo PARK , Kyung Hwan KIM
CPC classification number: H01Q13/0233 , H01Q21/0062
Abstract: A horn antenna for a millimeter wave comprises: a horn radiator including a radiation part having an opening formed therein to radiate a feed signal, and a multi-layer PCB coupling part coupled to lower and side portions of the radiation part to provide a feed signal; and a multi-layer PCB coupled to a lower portion of the multi-layer PCB coupling part to provide a feed signal, wherein a slot and a groove connected to the slot and extending in a direction parallel to the multi-layer PCB are formed in the multi-layer PCB coupling part, wherein a feed line vertically overlapping the slot and the groove is formed on a first layer substrate, which is the uppermost layer of the multi-layer PCB, wherein the opening extends in a direction parallel to the multi-layer PCB, and wherein a ‘¬’-shaped waveguide extending from the slot is formed in the horn radiator.
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公开(公告)号：US20230294389A1
公开(公告)日：2023-09-21
申请号：US18184831
申请日：2023-03-16
Applicant: SENSORVIEW CO., LTD.
Inventor： Byoung Nam KIM , Hong Il YOO , Jong Yup LEE , Chul-Keun PARK
CPC classification number: B32B37/24 , B32B7/12 , B32B15/043 , H01Q1/38
Abstract: A method for producing a substrate for millimeter wave comprises the steps of: (a) mixing ceramic powder and Teflon powder; (b) dispersing the mixed ceramic powder and Teflon powder in a dispersion equipment; (c) after the step of (b) dispersing is completed, outputting a paste of a mixture of the ceramic powder and the Teflon powder by additionally adding a solution and a binder to the dispersion equipment and then dispersing the mixture; (d) applying the paste to a first metal thin film; (e) drying the first metal thin film to which the paste is applied; and (f) laminating a second metal thin film on the opposite side of the paste bonded to the dried first metal thin film and then thermally bonding it.
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公开(公告)号：US20230129616A1
公开(公告)日：2023-04-27
申请号：US18047089
申请日：2022-10-17
Applicant: SENSORVIEW CO., LTD.
Inventor： Byoung Nam KIM , Hong Il YOO , Chul-Keun PARK , Chan-Woo PARK
IPC: H01Q1/22 , H01Q1/38 , G06K19/077
Abstract: An RFIC assembled antenna comprises: a first layer substrate including a first metal pattern, a first slot formed in the first metal pattern, and a second slot formed to be connected to the first slot, and in which an RFIC chip is coupled to a region of the second slot; and a second layer substrate coupled to a lower portion of the first layer substrate and including a second metal pattern, a third slot formed in the second metal pattern, and a dipole radiator formed inside the third slot, wherein a feeding pattern connected to the RFIC chip to provide a feed signal to the dipole radiator is formed inside the first slot.
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