Invention Application
- Patent Title: SUBSTRATE POLISHING APPARATUS, SUBSTRATE POLISHING SYSTEM INCLUDING THE SAME, AND SUBSTRATE POLISHING METHOD USING THE SAME
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Application No.: US17825449Application Date: 2022-05-26
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Publication No.: US20230131040A1Publication Date: 2023-04-27
- Inventor: Jaehyug LEE , Chae Lyoung KIM , Hoyoung KIM , Seungjun LEE
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2021-0142062 20211022
- Main IPC: B24B37/04
- IPC: B24B37/04 ; B24B37/07

Abstract:
Disclosed are substrate polishing apparatuses, substrate polishing systems, and/or substrate polishing methods. The substrate polishing apparatus may include an electric field applying module, and a platen that rotates a polishing pad. The electric field applying module may include an inner electrode having a circular shape when viewed in plan. The platen may be on the inner electrode. A central axis of the inner electrode may be spaced apart from a central axis of the platen. The inner electrode may include a first electrode and a second electrode that may surround the first electrode and may have an annular shape.
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