公开(公告)号：US12090601B2

公开(公告)日：2024-09-17

申请号：US17711239

申请日：2022-04-01

申请人： Samsung Display Co., Ltd.

发明人： Junggun Nam ,  Seungik Kang ,  Seungbae Kang ,  Pungseok Kim ,  Heesung Yang ,  Keunwoo Lee ,  Woojin Cho ,  Byoungkwon Choo

IPC分类号： B24B37/07 ,  B24B37/20 ,  B32B38/00

CPC分类号： B24B37/07 ,  B32B38/0012 ,  B24B37/20 ,  B32B2038/0064 ,  B32B2457/20

摘要： An apparatus for manufacturing a display device includes a moving part including a belt that circulates, a roller that circulates the belt, and at least one meandering prevention portion that moves in a first direction parallel to a direction of a rotation shaft of the roller and prevents meandering of the belt, and a polishing head disposed corresponding to the moving part, the polishing head polishing a surface of a base material disposed on a first surface of the belt. A part of the at least one meandering prevention portion faces a second surface of the belt, the second surface being a side surface of the belt.

公开(公告)号：US11931855B2

公开(公告)日：2024-03-19

申请号：US16885753

申请日：2020-05-28

申请人： Applied Materials, Inc.

发明人： Han-Wen Chen ,  Steven Verhaverbeke ,  Tapash Chakraborty ,  Prayudi Lianto ,  Prerna Sonthalia Goradia ,  Giback Park ,  Chintan Buch ,  Pin Gian Gan ,  Alex Hung

IPC分类号： B24B37/04 ,  B24B21/04 ,  B24B37/07 ,  B24B37/14

CPC分类号： B24B37/042 ,  B24B21/04 ,  B24B37/14 ,  B24B37/07

摘要： Embodiments of the present disclosure generally relate to planarization of surfaces on substrates and on layers formed on substrates. More specifically, embodiments of the present disclosure relate to planarization of surfaces on substrates for advanced packaging applications, such as surfaces of polymeric material layers. In one implementation, the method includes mechanically grinding a substrate surface against a polishing surface in the presence of a grinding slurry during a first polishing process to remove a portion of a material formed on the substrate; and then chemically mechanically polishing the substrate surface against the polishing surface in the presence of a polishing slurry during a second polishing process to reduce any roughness or unevenness caused by the first polishing process.

公开(公告)号：US20210362285A1

公开(公告)日：2021-11-25

申请号：US17314542

申请日：2021-05-07

申请人： TOKYO ELECTRON LIMITED

发明人： Toshimitsu IGATA

IPC分类号： B24B9/06 ,  B24B37/34 ,  B24B37/07 ,  B24B37/04 ,  B24B37/26 ,  B24B37/16

摘要： A substrate processing apparatus includes: a holding portion configured to hold a substrate including a bevel and an end surface in a peripheral edge portion of the substrate; a rotator configured to rotate the holding portion; a polishing head configured to be brought into contact with the peripheral edge portion of the substrate held by the holding portion and to polish the peripheral edge portion of the substrate; and a holder to which the polishing head is installed.

公开(公告)号：US10600655B2

公开(公告)日：2020-03-24

申请号：US15961133

申请日：2018-04-24

申请人： Rohm and Haas Electronic Materials CMP Holdings, Inc.

发明人： Jia-De Peng ,  Lin-Chen Ho ,  Syin Hsu

IPC分类号： H01L23/532 ,  H01L21/768 ,  H01L21/321 ,  H01L21/3205 ,  H01L21/306 ,  H01L21/304 ,  H01L21/302 ,  H01L21/02 ,  C09G1/02 ,  B24B57/02 ,  B24B37/07 ,  B24B37/04

摘要： A process for chemical mechanical polishing a substrate containing tungsten to at least reduce dishing of tungsten features of 100 μm or less. The process includes providing a substrate containing tungsten features of 100 μm or less; providing a polishing composition, containing, as initial components: water; an oxidizing agent; arginine or salts thereof; a dicarboxylic acid, a source of iron ions; a colloidal silica abrasive; and, optionally, a pH adjusting agent; and, optionally, a surfactant; and, optionally, a biocide; providing a chemical mechanical polishing pad, having a polishing surface; creating dynamic contact at an interface between the polishing pad and the substrate; and dispensing the polishing composition onto the polishing surface at or near the interface between the polishing pad and the substrate; wherein some of the tungsten is polished away from the substrate and yet at least reducing dishing of the tungsten features of 100 μm or less.

公开(公告)号：US09757839B2

公开(公告)日：2017-09-12

申请号：US15386647

申请日：2016-12-21

申请人： SUNSEA TELECOMMUNICATIONS CO., LTD.

发明人： Qiyue Wang ,  Xinjun Chen ,  Qingqing Hu

IPC分类号： B24B7/24 ,  B24B23/03 ,  B24B37/07 ,  B24B37/30 ,  B24B37/34

CPC分类号： B24B37/07 ,  B24B19/226 ,  B24B37/30 ,  B24B37/34

摘要： A grinder for grinding an end face of a fiber includes a housing, a fiber fixing module, a base, a transmission shaft, and a grinding pad. The housing includes an annular rack wheel with an internal engaging teeth. The fiber fixing module is positioned on a top of the housing. The base is positioned at a bottom of the housing and includes an eccentric connection portion. An end of the transmission shaft is connected to the connection portion. The transmission shaft is sleeved with an annular pinion having external engaging teeth engaging with the internal engaging teeth. The grinding pad is connected to another end of the transmission shaft and revolves around the rotation axis of the base and rotates around its own rotation axis together with the transmission shaft and matches an end face of a to-be-ground fiber penetrating the fiber fixing module.

公开(公告)号：US09403255B2

公开(公告)日：2016-08-02

申请号：US13905763

申请日：2013-05-30

申请人： Ebara Corporation

发明人： Makoto Fukushima ,  Hozumi Yasuda ,  Keisuke Namiki ,  Osamu Nabeya ,  Shingo Togashi ,  Satoru Yamaki

IPC分类号： B24B37/32 ,  B24B37/005 ,  B24B37/07 ,  B24B37/04 ,  B24B7/22 ,  B24B49/16

CPC分类号： B24B37/005 ,  B24B7/228 ,  B24B37/042 ,  B24B37/07 ,  B24B37/32 ,  B24B49/16

摘要： A polishing apparatus polishes a substrate by bringing the substrate into sliding contact with a polishing surface. The polishing apparatus includes: a substrate holder having a substrate holding surface configured to press the substrate against the polishing surface, a retaining ring coupled to the substrate holding surface and configured to surround the substrate, wherein the retaining ring is brought into contact with the polishing surface during operation of the polishing apparatus, the retaining ring being configured to be tiltable independently of the substrate holding surface; a rotating mechanism configured to rotate the substrate holder about its own axis; and at least one local load exerting mechanism configured to exert a local load on a part of the retaining ring in a direction perpendicular to the polishing surface, the at least one local load exerting mechanism being arranged so as not to move in accordance with the substrate holder.

摘要翻译： 抛光装置通过使基板与抛光表面滑动接触来抛光基板。 抛光装置包括：基板保持器，其具有被配置为将基板压靠在抛光表面上的基板保持表面;保持环，其联接到基板保持表面并且构造成围绕基板，其中保持环与抛光接触 所述保持环被构造成可以独立于所述基板保持表面倾斜; 旋转机构，其构造成使所述衬底保持器围绕其自身的轴线旋转; 以及至少一个局部负载施加机构，其被构造成沿与所述抛光表面垂直的方向在所述保持环的一部分上施加局部负载，所述至少一个局部负载施加机构被布置成不依照所述衬底移动 持有人

公开(公告)号：US20130084783A1

公开(公告)日：2013-04-04

申请号：US13611110

申请日：2012-09-12

申请人： Tomohide Jozaki ,  Shunsuke Matsui

发明人： Tomohide Jozaki ,  Shunsuke Matsui

IPC分类号： B24B37/27 ,  B24B37/07

CPC分类号： B24B37/08 ,  B24B7/17 ,  B24B13/015 ,  B24B37/28

摘要： There is provided a grinding apparatus including: an upper surface plate; a lower surface plate disposed facing the upper surface plate and rotating in an opposite direction to the upper surface plate; a sun gear rotated by a same rotational shaft as the upper surface plate and the lower surface plate; an internal gear rotated by the same rotational shaft as the upper surface plate and the lower surface plate; and a planetary carrier in which a holding hole that holds a workpiece is formed and which revolves while rotating in engagement with the sun gear and the internal gear. The holding hole in the planetary carrier is provided with a cutaway in a side of the holding hole that contacts a side surface of the workpiece when the planetary carrier rotates.

摘要翻译： 提供了一种研磨装置，包括：上表面板; 下表面板，设置成面向上表面板并且沿与上表面板相反的方向旋转; 由与上表面板和下表面板相同的旋转轴旋转的太阳齿轮; 由与上表面板和下表面板相同的旋转轴旋转的内齿轮; 以及行星架，其中形成有保持工件的保持孔，并且与星形齿轮和内齿轮接合旋转。 行星架上的保持孔在行星齿轮架旋转时在保持孔的与侧面相接触的一侧设置有切口。

公开(公告)号：US20050260928A1

公开(公告)日：2005-11-24

申请号：US10648403

申请日：2003-08-27

申请人： Hyun Huh ,  Sang-Mok Lee ,  Kee-Cheon Song ,  Seung-Geun Kim ,  Do-Kwon Son

发明人： Hyun Huh ,  Sang-Mok Lee ,  Kee-Cheon Song ,  Seung-Geun Kim ,  Do-Kwon Son

IPC分类号： B24B1/00 ,  B24B37/07 ,  B24B37/20 ,  B24B37/22 ,  B24B37/24 ,  B24D3/00 ,  B24D3/32 ,  B24D11/00 ,  H01L21/304

CPC分类号： B24B37/205 ,  B24D3/32 ,  Y10T428/24372 ,  Y10T428/24405 ,  Y10T428/24612 ,  Y10T428/24983 ,  Y10T428/249978 ,  Y10T428/24998 ,  Y10T428/249988 ,  Y10T428/2984

摘要： An integral polishing pad includes an elastic support layer and a polishing layer, which is formed on the elastic support layer and has a higher hardness than the elastic support layer. The elastic support layer and the polishing layer are made from materials chemically compatible with each other so that a structural border between the elastic support layer and the polishing layer does not exist. In addition, the integral polishing pad also includes a transparent region, which is transparent to a light source used to detect the surface state of an object being polished and integrated with the other elements of the integral polishing pad. The integral polishing pad has high planarization efficiency and uniform properties, and thus can be reliably used for polishing. In addition, the integral polishing pad prevents a congestion of a polishing slurry and facilitates delivery of the polishing slurry. The integral polishing pad does not need an adhesive for connecting elements or a process for bonding the elements, thereby simplifying manufacturing processes.

摘要翻译： 整体抛光垫包括弹性支撑层和抛光层，其形成在弹性支撑层上并且具有比弹性支撑层更高的硬度。 弹性支撑层和抛光层由彼此化学相容的材料制成，使得弹性支撑层和抛光层之间的结构边界不存在。 此外，整体抛光垫还包括对于用于检测待抛光物体的表面状态的光源透明的透明区域，并与整体抛光垫的其它元件集成。 整体抛光垫具有高的平坦化效率和均匀的性能，因此可以可靠地用于抛光。 此外，整体抛光垫防止抛光浆料的挤塞并且有利于抛光浆料的输送。 整体抛光垫不需要用于连接元件的粘合剂或用于粘合元件的工艺，从而简化了制造工艺。

公开(公告)号：US06106369A

公开(公告)日：2000-08-22

申请号：US186885

申请日：1998-11-06

申请人： Nobuo Konishi ,  Mitsuaki Iwashita

发明人： Nobuo Konishi ,  Mitsuaki Iwashita

IPC分类号： B24B37/07 ,  B24B37/10 ,  B24B49/16 ,  B24B57/02 ,  B24B1/00

CPC分类号： B24B49/16 ,  B24B37/04 ,  B24B57/02

摘要： A polishing system comprises: a rotating mounting table 14 which is rotatable while holding an object W to be polished; a rotating polishing plate 28 which has a smaller diameter than that of the rotating mounting table and which is provided with an abrasive layer 30 on the surface thereof; a scanning mechanism 26 for moving the rotating polishing plate in radial directions of the rotating mounting table while pressing the abrasive layer on the object; and abrasive solution supply means 46 for supplying an abrasive solution to the surface of the object. Thus, the system can be decreased in size, and the polished quantity can be partially controlled.

摘要翻译： 抛光系统包括：旋转安装台14，其可旋转，同时保持待抛光的物体W; 具有比旋转安装台的直径小的旋转研磨板28，并且在其表面上设置有研磨层30; 扫描机构26，用于在旋转的安装台的径向方向上移动旋转的抛光板，同时将研磨层按压在物体上; 以及用于将磨料溶液供给到物体表面的磨料溶液供给装置46。 因此，可以减小系统的尺寸，并且可以部分地控制抛光量。

公开(公告)号：US5672091A

公开(公告)日：1997-09-30

申请号：US577536

申请日：1995-12-22

申请人： Tsutomu Takahashi ,  Keiichi Tohyama ,  Tamami Takahashi

发明人： Tsutomu Takahashi ,  Keiichi Tohyama ,  Tamami Takahashi

IPC分类号： B24B37/013 ,  B24B37/07 ,  B24B49/02 ,  B24B49/12 ,  H01L21/304 ,  B24B49/00 ,  B24B51/00

CPC分类号： B24B37/013 ,  B24B49/02 ,  B24B49/12

摘要： A polishing apparatus has an automated endpoint detection device to determine if an endpoint of polishing has been reached without removing the wafer from a top ring of the polishing apparatus. When a pre-determined inspection time is reached in a process of polishing, the wafer is moved laterally along the turntable and the current surface condition of the wafer is determined by comparing the current surface condition with an initial surface condition, having an oxide film for example, determined from surface reflection measurement data carried out opto-electronically on the wafer before polishing. The endpoint detection device can be used to remove the surface oxide film so that the apex of the underlying device elements are just exposed. By eliminating the need for removing the wafer from the top ring for inspection, the cost of handling the wafer for polishing is reduced significantly, and enables reduction in the cost of manufactured devices. The endpoint determination device is applicable to any type of flat objects, such as LCD panels, requiring a high degree of polishing precision.

摘要翻译： 抛光装置具有自动终点检测装置，用于确定是否已经到达抛光的终点，而不从抛光装置的顶环移除晶片。 当在抛光过程中达到预定的检查时间时，晶片沿着转台横向移动，并且通过将当前表面状态与初始表面状态进行比较来确定晶片的当前表面状态，该初始表面状态具有氧化膜 例如，从在抛光之前在晶片上以电子方式进行的表面反射测量数据确定。 端点检测装置可以用于去除表面氧化膜，使得下面的器件元件的顶点刚刚暴露。 通过不需要从顶环去除晶片以进行检查，因此显着降低了处理用于抛光的晶片的成本，并且能够降低制造的器件的成本。 端点确定装置适用于需要高度抛光精度的任何类型的平面物体，例如LCD面板。