Invention Application
- Patent Title: RINSING LIQUID AND PATTERN FORMING METHOD
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Application No.: US18062021Application Date: 2022-12-06
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Publication No.: US20230132693A1Publication Date: 2023-05-04
- Inventor: Satomi TAKAHASHI , Toru TSUCHIHASHI
- Applicant: FUJIFILM Corporation
- Applicant Address: JP tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP tokyo
- Priority: JP2020-101795 20200611
- Main IPC: G03F7/32
- IPC: G03F7/32

Abstract:
An object of the present invention is to provide a rinsing liquid that has excellent resolution and excellent film thickness loss suppressiveness in a case where the rinsing liquid is used to rinse a resist film and a pattern forming method that uses the rinsing liquid. The rinsing liquid according to an embodiment of the present invention is a rinsing liquid for resist film patterning for a resist film obtained from an actinic ray-sensitive or radiation-sensitive composition, and contains at least a first ester-based solvent having 7 carbon atoms other than an acetate.
Information query
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