Invention Application
- Patent Title: ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
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Application No.: US18063496Application Date: 2022-12-08
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Publication No.: US20230133710A1Publication Date: 2023-05-04
- Inventor: Aina USHIYAMA , Akira TAKADA , Masafumi KOJIMA , Akiyoshi GOYO , Michihiro SHIRAKAWA , Keita KATO
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Priority: JP2020-101122 20200610,JP2020-215336 20201224,JP2021-026307 20210222
- Main IPC: G03F7/004
- IPC: G03F7/004 ; G03F7/039 ; G03F7/20

Abstract:
An object of the present invention is to provide an actinic ray-sensitive or radiation-sensitive resin composition with which a pattern having excellent LWR performance can be formed even after the composition is stored for a long period of time. In addition, another object of the present invention is to provide a resist film, a pattern forming method, and a method for manufacturing an electronic device, each relating to the actinic ray-sensitive or radiation-sensitive resin composition. The actinic ray-sensitive or radiation-sensitive resin composition of an embodiment of the present invention includes a resin of which polarity increases through decomposition by an action of an acid, and a compound that generates an acid upon irradiation with actinic rays or radiation, and the compound that generates an acid upon irradiation with actinic rays or radiation is selected from compounds (I) and (II).
Information query
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