Invention Application
- Patent Title: FAR INFRARED SENSOR APPARATUS HAVING MULTIPLE SENSING ELEMENT ARRAYS INSIDE SINGLE PACKAGE
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Application No.: US18090511Application Date: 2022-12-29
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Publication No.: US20230133741A1Publication Date: 2023-05-04
- Inventor: Chih-Ming Sun , Sen-Huang Huang
- Applicant: PixArt Imaging Inc.
- Applicant Address: TW Hsin-Chu City
- Assignee: PixArt Imaging Inc.
- Current Assignee: PixArt Imaging Inc.
- Current Assignee Address: TW Hsin-Chu City
- Priority: TW105127775 20160830
- Main IPC: G01J5/12
- IPC: G01J5/12 ; G01J1/02 ; G01J5/04 ; G01J5/10 ; G01J1/42 ; G01J5/08 ; G01J5/14
Abstract:
A far infrared sensor package includes a package body and a plurality of far infrared sensor array integrated circuits. The plurality of far infrared sensor array integrated circuits are disposed on a same plane and inside the package body. Each of the far infrared sensor array integrated circuits includes a far infrared sensing element array of a same size.
Public/Granted literature
- US11874174B2 Far infrared sensor apparatus having multiple sensing element arrays inside single package Public/Granted day:2024-01-16
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