公开(公告)号：US20250044159A1

公开(公告)日：2025-02-06

申请号：US18362333

申请日：2023-07-31

Applicant: Rolls-Royce Corporation ,  Rolls-Royce North American Technologies Inc.

Inventor： John Costello ,  Robert C. Dalley ,  Douglas Schetzel

IPC: G01J5/90 ,  F01D21/00 ,  F01D21/12 ,  G01J5/00 ,  G01J5/14

Abstract: A method of monitoring a health of a temperature system may comprise selecting a temperature sensor of a plurality of temperature sensors arranged in an array, where each temperature sensor corresponds to an address within the array. The method may comprise identifying the address corresponding to the single temperature sensor, sending the address to a multiplexer, and selecting the single temperature sensor using the identified address. The method may comprise testing the selected single temperature sensor calculating an average temperature detected by the plurality of temperatures sensors.

公开(公告)号：US20240230414A9

公开(公告)日：2024-07-11

申请号：US17970539

申请日：2022-10-20

Applicant: ORIENTAL SYSTEM TECHNOLOGY INC.

Inventor： Chein-Hsun WANG ,  Ming LE ,  Tung-Yang LEE ,  Yu-Chih LIANG ,  Wen-Chie HUANG ,  Chen-Tang HUANG ,  Jenping KU

IPC: G01J5/07 ,  G01J5/14

CPC classification number: G01J5/07 ,  G01J5/14

Abstract: A temperature sensing device includes a substrate, a first reflective module, a first window cover, and a dual thermopile sensor. The first reflective module is disposed on the substrate, including a first mirror chamber with a narrow field of view (FOV), and the first reflective module focuses a thermal radiation from measured object to a first image plane in the first mirror chamber. The first window cover is disposed on the first reflective module, and the first window cover allows a selected band of the thermal radiation to pass through. The dual thermopile sensor is disposed on the substrate and located in the first mirror chamber, and the dual thermopile sensor senses a temperature data from the first image plane. Additional second reflective module, LED source plus pin hole with same FOV of dual thermopile sensor can illuminate the measured object for ease of placement of object to be heated.

公开(公告)号：US11808633B2

公开(公告)日：2023-11-07

申请号：US17403117

申请日：2021-08-16

Applicant: ORIENTAL SYSTEM TECHNOLOGY INC.

Inventor： Chein-Hsun Wang ,  Da-Jun Lin ,  Chun-Chiang Chen ,  Chih-Yung Tsai ,  Yu-Chih Liang ,  Ming Le ,  Chen-Tang Huang ,  Tung-Yang Lee ,  Jenping Ku

IPC: G01J5/00 ,  G01J5/14 ,  G01J5/02 ,  G01K7/06 ,  G01K7/02 ,  G01J5/04 ,  H10N10/817

CPC classification number: G01J5/14 ,  G01J5/025 ,  G01J5/045 ,  G01K7/028 ,  G01K7/06 ,  H10N10/817

Abstract: An infrared thermopile sensor includes a silicon cover having an infrared lens, an infrared sensing chip having duo-thermopile sensing elements, and a microcontroller chip calculating a temperature of an object. The components are in a stacked 3D package to decrease the size of the infrared thermopile sensor. The infrared sensing chip and the microcontroller chip have metal layers to shield the thermal radiation. The conversion from wrist temperature to body core temperature uses detected ambient temperature and fixed humidity or imported humidity level to calculate the body core temperature based on experimental data and curve fitting. The skin temperature compensation can be set differently for different sex gender, different standard deviation of wrist temperature and external relative humidity reading.

公开(公告)号：US11644364B1

公开(公告)日：2023-05-09

申请号：US16515857

申请日：2019-07-18

Applicant: Louisiana Tech Research Corporation

Inventor： Arden Moore

IPC: G01J5/14 ,  G01J5/04 ,  G01J5/02

CPC classification number: G01J5/14 ,  G01J5/0205 ,  G01J5/046

Abstract: A thermopile sensor including a uniform substrate having a first surface with a first section and a second section at an elevation varying relative to the first section by between about 5 micrometers and about 500 micrometers. The sensor further includes a plurality of thermopile junctions, with each junction having (i) a first strip of a first conductive material, extending from the first section to the second section, (ii) a second strip of a second conductive material, forming an electrical junction with the first strip on the second section and extending to the first section, and (iii) with the thermopile junctions being connected in series. A first contact pad on the substrate is connected to an initial thermopile junction and a second contact pad on the substrate is connected to a last thermopile junction, with conductors connecting to the first and second contact pads and extending off of the substrate.

公开(公告)号：US20220252458A1

公开(公告)日：2022-08-11

申请号：US17437640

申请日：2020-02-17

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Ryota SUDO ,  Takanori SUGIYAMA ,  Takaaki HIRAMATSU ,  Nobuaki SHIMAMOTO ,  Hiroshi YAMANAKA ,  Naoki KOBAYASHI

IPC: G01J5/14 ,  G01J5/48

Abstract: A temperature sensing system senses a temperature in the monitor space. The temperature sensing system includes a first detector, a second detector, and a processing unit. The first detector detects a temperature on a ceiling and outputs first information about the temperature on the ceiling. The second detector detects infrared radiation emitted from a floor and outputs second information about the infrared radiation from the floor. The processing unit calculates, based on at least the first information and the second information, a spatial temperature distribution which includes a component in a height direction with respect to the monitor space between the ceiling and the floor.

公开(公告)号：US10948355B2

公开(公告)日：2021-03-16

申请号：US16710778

申请日：2019-12-11

Applicant: HEIMANN SENSOR GMBH

Inventor： Bodo Forg ,  Michael Schnorr ,  Jörg Schieferdecker ,  Karlheinz Storck ,  Marion Simon ,  Wilhelm Leneke

IPC: G01J5/02 ,  G01J5/08 ,  G01J5/06 ,  G01F1/688 ,  H04N5/33 ,  H04N5/378 ,  G01J5/12 ,  G01J5/14 ,  G01J5/22

Abstract: A high-resolution thermopile infrared sensor array having monolithically integrated signal processing and a plurality of parallel signal processing channels for the signals from pixels of a sensor array, and a digital port for the serial output of the pixel signals are provided, wherein the sensor array is located on one or more sensor chips. The thermal piled infrared sensor array possesses low power loss, high integration density and high thermal and geometric resolution. Each signal processing channel (K1 . . . KN) has at least one analogue/digital converter (ADC), and is assigned a memory region in a memory (RAM) for storing the signals from the pixels (SE).

公开(公告)号：US10914636B2

公开(公告)日：2021-02-09

申请号：US15923670

申请日：2018-03-16

Applicant: AMS Sensors UK Limited

Inventor： Syed Zeeshan Ali ,  Kaspars Ledins

IPC: G01J5/12 ,  G01R31/26 ,  G01J5/02 ,  G01J5/14 ,  H01L35/34 ,  G01J5/00

Abstract: We disclose herein a method for testing and/or calibrating a thermopile based device. The method comprising: applying an electrical bias of a first polarity to the thermopile based device and measuring a first value of an electrical parameter; and applying an electrical bias of a second polarity to the thermopile based device and measuring a second value of an electrical parameter.

公开(公告)号：US20190219448A1

公开(公告)日：2019-07-18

申请号：US16359798

申请日：2019-03-20

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Kouhei TAKAHASHI ,  Takashi KAWASAKI ,  Yasuyuki NAITO ,  Morio TOMIYAMA

IPC: G01J5/02 ,  G01J5/20 ,  G01J5/22 ,  G01J5/12 ,  G01J5/14

CPC classification number: G01J5/02 ,  G01J5/023 ,  G01J5/046 ,  G01J5/06 ,  G01J5/12 ,  G01J5/14 ,  G01J5/20 ,  G01J5/22 ,  G01J2005/123

Abstract: An infrared sensor is formed in such a manner that an infrared receiver and a base substrate are spaced with a beam made of a thin-film phononic crystal in which through holes are arranged periodically. The beam made of a phononic crystal is formed in such a manner that a period P of through holes increases at arbitrary intervals in a direction from the infrared receiver toward the base substrate.

公开(公告)号：US20180283958A1

公开(公告)日：2018-10-04

申请号：US15766100

申请日：2016-07-05

Applicant: HEIMANN SENSOR GMBH

Inventor： Bodo FORG ,  Michael SCHNORR ,  Jörg SCHIEFERDECKER ,  Karlheinz STORCK ,  Marion SIMON ,  Wilhelm LENEKE

IPC: G01J5/08 ,  G01J5/22 ,  H04N5/33 ,  H04N5/378 ,  G01J5/14

CPC classification number: G01J5/0881 ,  G01F1/6888 ,  G01J5/06 ,  G01J5/12 ,  G01J5/14 ,  G01J5/22 ,  H04N5/33 ,  H04N5/378

Abstract: A high-resolution thermopile infrared sensor array having monolithically integrated signal processing and a plurality of parallel signal processing channels for the signals from pixels of a sensor array, and a digital port for the serial output of the pixel signals are provided, wherein the sensor array is located on one or more sensor chips. The thermal piled infrared sensor array possesses low power loss, high integration density and high thermal and geometric resolution. Each signal processing channel (K1 . . . KN) has at least one analogue/digital converter (ADC), and is assigned a memory region in a memory (RAM) for storing the signals from the pixels (SE).

公开(公告)号：US10042170B2

公开(公告)日：2018-08-07

申请号：US14904182

申请日：2014-06-30

Applicant: VALEO COMFORT AND DRIVING ASSISTANCE

Inventor： Michael Irzyk

IPC: G01J5/02 ,  G02B27/01 ,  G01S17/02 ,  G06F3/01 ,  G02B27/00 ,  H04N5/232 ,  G01J5/00 ,  G01J5/14 ,  H04N5/33

Abstract: The invention relates to a device (1) for detecting the position of the face (2) of a person, in particular of a motor vehicle driver, wherein said device includes: a thermal sensor (4) configured for determining the heat generated from a target area (6) likely to be occupied by a person, in the form of a dot (10) matrix (8), each dot (10) in said matrix (8) representing the heat generated by a portion of said target area (6), processing means for analyzing a value acquired through a physical quantity for the dots (10) of said matrix (8) in order to detect at least one piece of adjustment information (12) that is representative of the position of said face (2) within said target area (6). The invention also relates to a corresponding detection method and display, in particular a head-up display, provided with said device.