A mounting structure of a multilayer ceramic capacitor includes a substrate, and a multilayer ceramic capacitor connected to the substrate and including a laminate including dielectric layers and internal electrode layers, and external electrodes on main surfaces of the laminate. The laminate further includes first, second, third, and fourth via conductors connecting the internal electrode layers and the external electrodes. The external electrodes include first, second, third, and fourth external electrodes, each connected to respective end surfaces of the via conductor. Each of the external electrodes does not extend to the side surfaces of the laminate. A ratio W/L of a dimension W in the width direction of the multilayer ceramic capacitor to a dimension L in the length direction of the multilayer ceramic capacitor is about 0.85 or more and about 1 or less.