Invention Application
- Patent Title: POLISHING COMPOSITIONS AND METHODS OF USE THEREOF
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Application No.: US17970667Application Date: 2022-10-21
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Publication No.: US20230135325A1Publication Date: 2023-05-04
- Inventor: Yannan Liang , Bin Hu , Abhudaya Mishra , Ting-Kai Huang , Yibin Zhang , James Johnston , James McDonough
- Applicant: Fujifilm Electronic Materials U.S.A., Inc.
- Applicant Address: US RI N. Kingstown
- Assignee: Fujifilm Electronic Materials U.S.A., Inc.
- Current Assignee: Fujifilm Electronic Materials U.S.A., Inc.
- Current Assignee Address: US RI N. Kingstown
- Main IPC: C09G1/02
- IPC: C09G1/02 ; H01L21/306
Abstract:
A polishing composition includes an anionic abrasive, a pH adjuster a low-k removal rate inhibitor, a ruthenium removal rate enhancer, and water. A method of polishing a substrate includes the steps of: applying the polishing composition described herein to a surface of a substrate, wherein the surface comprises ruthenium or a hard mask material; and bringing a pad into contact with the surface of the substrate and moving the pad in relation to the substrate.
Information query
