Invention Application
- Patent Title: POLISHING SLURRY COMPOSITION
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Application No.: US17977702Application Date: 2022-10-31
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Publication No.: US20230136640A1Publication Date: 2023-05-04
- Inventor: Chang Gil KWON , Sung Pyo LEE
- Applicant: KCTECH CO., LTD.
- Applicant Address: KR Gyeonggi-do
- Assignee: KCTECH CO., LTD.
- Current Assignee: KCTECH CO., LTD.
- Current Assignee Address: KR Gyeonggi-do
- Priority: KR10-2021-0148153 20211101
- Main IPC: C09G1/02
- IPC: C09G1/02 ; H01L21/306
Abstract:
Provided is a polishing slurry composition including abrasive particles, a dispersant, a pH buffering agent, and a dishing inhibitor including at least one selected from a group consisting of a saccharides compound, an amino acid, and a mixture thereof.
Information query
