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公开(公告)号：US20230136640A1
公开(公告)日：2023-05-04
申请号：US17977702
申请日：2022-10-31
Applicant: KCTECH CO., LTD.
Inventor： Chang Gil KWON , Sung Pyo LEE
IPC: C09G1/02 , H01L21/306
Abstract: Provided is a polishing slurry composition including abrasive particles, a dispersant, a pH buffering agent, and a dishing inhibitor including at least one selected from a group consisting of a saccharides compound, an amino acid, and a mixture thereof.
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