Invention Publication
- Patent Title: GATE SPACER IN STACKED GATE-ALL-AROUND (GAA) DEVICE ARCHITECTURE
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Application No.: US17854242Application Date: 2022-06-30
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Publication No.: US20240006499A1Publication Date: 2024-01-04
- Inventor: Cheng-Ying Huang , Kai Loon Cheong , Pooja Nath , Susmita Ghose , Rambert Nahm , Natalie Briggs , Charles C. Kuo , Nicole K. Thomas , Munzarin F. Qayyum , Marko Radosavljevic , Jack T. Kavalieros , Thoe Michaelos , David Kohen
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01L29/423
- IPC: H01L29/423 ; H01L29/786 ; H01L29/66

Abstract:
An integrated circuit includes an upper semiconductor body extending in a first direction from an upper source region to an upper drain region, and a lower semiconductor body extending in the first direction from a lower source region to a lower drain region. The upper body is spaced vertically from the lower body in a second direction orthogonal to the first direction. A gate spacer structure is adjacent to the upper and lower source regions. In an example, the gate spacer structure includes (i) a first section having a first dimension in the first direction, and (ii) a second section having a second dimension in the first direction. In an example, the first dimension is different from the second dimension by at least 1 nm. In some cases, an intermediate portion of the gate spacer structure extends laterally within a given gate structure, or between upper and lower gate structures.
Information query
IPC分类: