Invention Publication
- Patent Title: GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING ADJACENT STRUCTURES FOR SUB-FIN ELECTRICAL CONTACT
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Application No.: US18368428Application Date: 2023-09-14
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Publication No.: US20240006504A1Publication Date: 2024-01-04
- Inventor: Biswajeet GUHA , William HSU , Chung-Hsun LIN , Kinyip PHOA , Oleg GOLONZKA , Tahir GHANI
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01L29/423
- IPC: H01L29/423 ; H01L27/088 ; H01L29/417 ; H01L29/786

Abstract:
Gate-all-around integrated circuit structures having adjacent structures for sub-fin electrical contact are described. For example, an integrated circuit structure includes a semiconductor island on a semiconductor substrate. A vertical arrangement of horizontal nanowires is above a fin protruding from the semiconductor substrate. A channel region of the vertical arrangement of horizontal nanowires is electrically isolated from the fin. The fin is electrically coupled to the semiconductor island. A gate stack is over the vertical arrangement of horizontal nanowires.
Public/Granted literature
- US12272737B2 Gate-all-around integrated circuit structures having adjacent structures for sub-fin electrical contact Public/Granted day:2025-04-08
Information query
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