Invention Publication
- Patent Title: MECHANOPHORE-GRAFTED POLYMERS TO FORM STRESS-RESPONSIVE THERMOSET NETWORK
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Application No.: US18356526Application Date: 2023-07-21
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Publication No.: US20240018296A1Publication Date: 2024-01-18
- Inventor: Lenore DAI , Aditi CHATTOPADHYAY , Elizabeth NOFEN , Jin ZOU , Bonsung KOO
- Applicant: Lenore DAI , Aditi CHATTOPADHYAY , Elizabeth NOFEN , Jin ZOU , Bonsung KOO
- Applicant Address: US AZ Phoenix
- Assignee: Lenore DAI,Aditi CHATTOPADHYAY,Elizabeth NOFEN,Jin ZOU,Bonsung KOO
- Current Assignee: Lenore DAI,Aditi CHATTOPADHYAY,Elizabeth NOFEN,Jin ZOU,Bonsung KOO
- Current Assignee Address: US AZ Phoenix
- The original application number of the division: US17328490 2021.05.24
- Main IPC: C08G59/14
- IPC: C08G59/14 ; C08G59/50 ; C08K5/20 ; C08L63/00 ; G01L1/24
Abstract:
Compositions including a thermosetting polymer network and a mechanophore covalently bonded to the thermosetting polymer network are provided. Substrates including the compositions are provided. In addition, methods of making the compositions and methods of monitoring stress on a substrate comprising the compositions are provided.
Public/Granted literature
- US12258439B2 Mechanophore-grafted polymers to form stress-responsive thermoset network Public/Granted day:2025-03-25
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