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公开(公告)号：US20240018296A1
公开(公告)日：2024-01-18
申请号：US18356526
申请日：2023-07-21
申请人： Lenore DAI , Aditi CHATTOPADHYAY , Elizabeth NOFEN , Jin ZOU , Bonsung KOO
发明人： Lenore DAI , Aditi CHATTOPADHYAY , Elizabeth NOFEN , Jin ZOU , Bonsung KOO
CPC分类号： C08G59/1477 , C08G59/5006 , C08K5/20 , C08L63/00 , G01L1/241
摘要： Compositions including a thermosetting polymer network and a mechanophore covalently bonded to the thermosetting polymer network are provided. Substrates including the compositions are provided. In addition, methods of making the compositions and methods of monitoring stress on a substrate comprising the compositions are provided.
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2.发明申请公开(公告)号：US20190393112A1
公开(公告)日：2019-12-26
申请号：US16017464
申请日：2018-06-25
IPC分类号： H01L23/29 , H01L25/065 , H01L23/31 , H01L23/538 , H01L21/56 , H01L25/00
摘要： Embodiments include an encapsulation material, one or more semiconductor packages, and methods of the semiconductor packages. A semiconductor package including dies disposed on a package substrate. The semiconductor package also includes at least one of an underfill layer, a mold layer, and a dielectric layer on or in the package substrate. The semiconductor package further includes an encapsulation material having a fluorescent chemical compound and an epoxy. The encapsulation material may be incorporated into at least one of the underfill layer, the mold layer, and/or the dielectric layer on or in the package substrate. The fluorescent chemical compound of the encapsulation material may include at least one of a poly(vinylcarbazole) (PVCz), a 1,4-Bis(5-phenyl-2-oxazolyl) benzene (POPOP), and/or a plurality of conjugated, aromatic molecules and polymers. The encapsulation material may include at least one of a hardener, a filler, an additive, and/or a polymer.
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公开(公告)号：US20210277172A1
公开(公告)日：2021-09-09
申请号：US17328490
申请日：2021-05-24
申请人： Lenore DAI , Aditi CHATTOPADHYAY , Elizabeth NOFEN , Jin ZOU , Bonsung KOO
发明人： Lenore DAI , Aditi CHATTOPADHYAY , Elizabeth NOFEN , Jin ZOU , Bonsung KOO
摘要： Compositions including a thermosetting polymer network and a mechanophore covalently bonded to the thermosetting polymer network are provided. Substrates including the compositions are provided. In addition, methods of making the compositions and methods of monitoring stress on a substrate comprising the compositions are provided.
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公开(公告)号：US11753498B2
公开(公告)日：2023-09-12
申请号：US17328490
申请日：2021-05-24
申请人： Lenore Dai , Aditi Chattopadhyay , Elizabeth Nofen , Jin Zou , Bonsung Koo
发明人： Lenore Dai , Aditi Chattopadhyay , Elizabeth Nofen , Jin Zou , Bonsung Koo
CPC分类号： C08G59/1477 , C08G59/5006 , C08K5/20 , C08L63/00 , G01L1/241
摘要： Compositions including a thermosetting polymer network and a mechanophore covalently bonded to the thermosetting polymer network are provided. Substrates including the compositions are provided. In addition, methods of making the compositions and methods of monitoring stress on a substrate comprising the compositions are provided.
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公开(公告)号：US11034791B2
公开(公告)日：2021-06-15
申请号：US16349221
申请日：2017-12-20
申请人： Lenore Dai , Aditi Chattopadhyay , Elizabeth Nofen , Jin Zou , Bonsung Koo
发明人： Lenore Dai , Aditi Chattopadhyay , Elizabeth Nofen , Jin Zou , Bonsung Koo
摘要： Compositions including a thermosetting polymer network and a mechanophore covalently bonded to the thermosetting polymer network are provided. Substrates including the compositions are provided. In addition, methods of making the compositions and methods of monitoring stress on a substrate comprising the compositions are provided.
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公开(公告)号：US20190099776A1
公开(公告)日：2019-04-04
申请号：US15720497
申请日：2017-09-29
申请人： Ken P. Hackenberg , Nachiket R. Raravikar , James C. Matayabas, JR. , Elizabeth Nofen , Nisha Ananthakrishnan , Manabu Nakagawasai , Yoshihiro Tomita
发明人： Ken P. Hackenberg , Nachiket R. Raravikar , James C. Matayabas, JR. , Elizabeth Nofen , Nisha Ananthakrishnan , Manabu Nakagawasai , Yoshihiro Tomita
摘要： A fluid applicator configured to apply a fluid to at least one substrate feature. The includes compressible reticulated media including an input interface configured for coupling with a fluid reservoir, and a substrate interface having an applicator profile corresponding to a feature profile of the at least one substrate feature. Reticulations extend from the input interface to the substrate interface, and the reticulations are distributed across the applicator profile. The compressible reticulated media includes filling and dispensing configurations. In the dispensing configuration the substrate interface is configured for engagement with the at least one substrate feature, the compressible reticulated media is compressed, and according to the compression the fluid is applied across the feature profile. In the filling configuration the compressible reticulated media is configured for expansion relative to the dispensing configuration, and the fluid infiltrates the reticulations according to the expansion.
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