发明公开
- 专利标题: MEMORY ARRAY
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申请号: US17866558申请日: 2022-07-18
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公开(公告)号: US20240021266A1公开(公告)日: 2024-01-18
- 发明人: Yao-Ting Tsai , Che-Fu Chuang
- 申请人: Winbond Electronics Corp.
- 申请人地址: TW Taichung City
- 专利权人: Winbond Electronics Corp.
- 当前专利权人: Winbond Electronics Corp.
- 当前专利权人地址: TW Taichung City
- 主分类号: G11C29/00
- IPC分类号: G11C29/00 ; G11C29/52
摘要:
A memory array is provided. The memory array includes multiple memory blocks, each including multiple data storage regions and multiple groups of word lines. Each group of word lines extend across one of the memory blocks. The groups of word lines are connected to multiple overlying signal lines through multiple groups of first word line contact regions in the memory blocks and multiple second word line contact regions between the memory blocks.
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