- 专利标题: SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
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申请号: US18163573申请日: 2023-02-02
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公开(公告)号: US20240021615A1公开(公告)日: 2024-01-18
- 发明人: Yoonjeong KIM , Yeongmin JEON , Hyewon JANG
- 申请人: SAMSUNG ELECTRONICS CO., LTD.
- 申请人地址: KR Suwon-si
- 专利权人: SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人地址: KR Suwon-si
- 优先权: KR 20220085550 2022.07.12
- 主分类号: H01L27/092
- IPC分类号: H01L27/092 ; H01L29/06 ; H01L29/417 ; H01L29/423 ; H01L29/775 ; H01L21/8238 ; H01L29/66
摘要:
A semiconductor device having active regions including a first active region and a second active region parallel to each other and respectively extending on a substrate in a first horizontal direction, a field region defining the active regions, a first insulating structure extending in the first horizontal direction on the field region, a gate structure extending, in a second horizontal direction, to intersect the active regions and the first insulating structure, source/drain regions disposed on at least one side of the gate structure, the source/drain regions including first source/drain regions on the first active region and second source/drain regions on the second active region, and a common contact plug on a first side of the gate structure and connected to the first and second source/drain regions opposing each other. The first insulating structure includes a first portion overlapping the gate structure in a vertical direction.
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