A radio frequency module includes a first module substrate that has a first main surface facing a second main surface, a second module substrate that has a third main surface facing a fourth main surface, the third main surface facing the second main surface, multiple electronic components that are disposed between the second main surface and the third main surface, on or along the first main surface, and on or along the fourth main surface, and a LC component that is disposed in the module substrate and that is an inductor or a capacitor. A relative dielectric constant of the module substrate is higher than a relative dielectric constant of the module substrate.