公开(公告)号：US20240250013A1

公开(公告)日：2024-07-25

申请号：US18583970

申请日：2024-02-22

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Motoji TSUDA ,  Kiyoshi AIKAWA ,  Takashi YAMADA ,  Toshiki MATSUI

IPC: H01L23/498 ,  H01L23/538 ,  H01L23/552 ,  H01L25/00 ,  H01L25/10

CPC classification number: H01L23/49838 ,  H01L23/5386 ,  H01L25/105 ,  H01L25/50 ,  H01L23/552

Abstract: A radio frequency module including a mounting substrate, a first electronic component, a second electronic component and a first connection terminal, a second connection terminal, a first resin layer, and a second resin layer. The second electronic component and the first connection terminal are disposed on a second main surface of the mounting substrate. The second connection terminal is connected to the first connection terminal, and is disposed on a side of the first connection terminal opposite to the mounting substrate side. The first resin layer covers at least a part of the second electronic component, and covers at least a part of the first connection terminals. The second resin layer is disposed on the first resin layer, and covers at least a part of the second connection terminal. The second connection terminal is located inside the first connection terminal in a plan view in a thickness direction of the mounting substrate.

公开(公告)号：US20240178871A1

公开(公告)日：2024-05-30

申请号：US18437360

申请日：2024-02-09

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takashi YAMADA ,  Kiyoshi AIKAWA ,  Motoji TSUDA

IPC: H04B1/38 ,  H03H7/38

CPC classification number: H04B1/38 ,  H03H7/38

Abstract: A radio-frequency module including a module substrate, a plurality of electronic components, a plurality of external connection terminals, a resin member, and a plurality of electrodes. The module substrate has first and second major surfaces that are opposite to each other. The plurality of electronic components are disposed at the major surface and at the major surface. The external connection terminals are disposed at the major surface and include a first external connection terminal. The resin member is disposed at the major surface. The plurality of electrodes are disposed at the major surface and coupled to the plurality of external connection terminals. The plurality of electronic components include a passive component disposed at the major surface. At least a portion of the first external connection terminal overlaps at least a portion of the passive component in plan view of the module substrate.

公开(公告)号：US20240038692A1

公开(公告)日：2024-02-01

申请号：US18477589

申请日：2023-09-29

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takashi YAMADA ,  Kiyoshi AIKAWA ,  Hiromichi KITAJIMA ,  Takanori UEJIMA ,  Yoshihiro DAIMON

IPC: H01L23/66 ,  H01L23/498 ,  H03F3/24 ,  H03F1/56 ,  H01L25/065

CPC classification number: H01L23/66 ,  H01L23/49822 ,  H01L23/49838 ,  H03F3/245 ,  H03F1/565 ,  H01L25/0652 ,  H01L2223/6655 ,  H01L2223/6677 ,  H01L2223/6616 ,  H03F2200/294 ,  H03F2200/451 ,  H01L2223/6672

Abstract: A high-frequency module includes a first module substrate including first and second major surfaces, and a second module substrate including third and fourth major surfaces. The first major surface (faces the second major surface. Electronic components are disposed between the second and third major surfaces, on the first major surface, and on the fourth major surface. External connection terminals are disposed on the fourth major surface. A recess is formed in the first major surface. The electronic components include a first electronic component and a second electronic component (shorter in height than the first electronic component. The first electronic component is disposed in the recess, and the second electronic component is disposed in a region outside of the recess on the first major surface.

公开(公告)号：US20240023263A1

公开(公告)日：2024-01-18

申请号：US18473289

申请日：2023-09-25

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshihiro DAIMON ,  Hiromichi KITAJIMA ,  Kiyoshi AIKAWA ,  Takashi YAMADA ,  Takanori UEJIMA

IPC: H05K7/02 ,  H05K1/18 ,  H05K1/14 ,  H05K1/02

CPC classification number: H05K7/026 ,  H05K1/181 ,  H05K1/144 ,  H05K1/0237 ,  H03F3/245

Abstract: A high-frequency module includes a module substrate having major surfaces, and a module substrate having major surfaces. The major surface are disposed facing the major surface. A first electronic component includes a filter coupled to a power amplifier and a low-noise amplifier. A second electronic component includes a filter coupled to a low-noise amplifier. A third electronic component includes a switch coupled between filters and an antenna connection terminal. The first electronic component is disposed between the major surfaces, on the major surface, or on the major surface. The second electronic component is disposed between the major surfaces, on the major surface, or on the major surface where the first electronic component is not disposed. The third electronic component is disposed between the major surfaces, on the major surface, or on the major surface wherein neither of the first nor second electronic component is disposed.

公开(公告)号：US20240014841A1

公开(公告)日：2024-01-11

申请号：US18473329

申请日：2023-09-25

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Hiromichi KITAJIMA ,  Takanori UEJIMA ,  Kiyoshi AIKAWA ,  Takashi YAMADA ,  Yoshihiro DAIMON

IPC: H04B1/38 ,  H04B1/00 ,  H03F3/24

CPC classification number: H04B1/38 ,  H04B1/006 ,  H03F3/24

Abstract: A radio-frequency module includes one or more first electronic components disposed on one main surface and one or more second electronic components disposed on another main surface. The one or more first electronic components include at least one of a filter whose passband includes a first band, a switch connected to the filter, a power amplifier connected to the filter, and a switch connected to the filter. The one or more second electronic components include at least one of a filter whose passband includes a second band in which the frequency of a harmonic wave of a signal in the first band is included, a switch connected to the filter, a low-noise amplifier connected to the filter, and an inductor connected to a path that forms a connection between the first low-noise amplifier and an antenna connection terminal.

公开(公告)号：US20240030957A1

公开(公告)日：2024-01-25

申请号：US18477561

申请日：2023-09-29

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kiyoshi AIKAWA ,  Takanori UEJIMA ,  Hiromichi KITAJIMA ,  Takashi YAMADA ,  Yoshihiro DAIMON

IPC: H04B1/38 ,  H03F3/24

CPC classification number: H04B1/38 ,  H03F3/245 ,  H03F2200/294 ,  H03F2200/451 ,  H03F2200/171

Abstract: A radio-frequency module includes a module substrate having major surfaces opposite to each other; a module substrate having major surfaces opposite to each other, the major surface being disposed facing the major surface; a plurality of external connection terminals disposed on the major surface; a plurality of inter-substrate connection terminals disposed between the major surfaces to couple the module substrate to the module substrate; a first electronic component (integrated circuit) including a switch; a second electronic component including a filter coupled to a power amplifier via the switch; and a third electronic component including a filter coupled to the power amplifier via the switch. The first electronic component, the second electronic component, and the third electronic component are disposed in the same module substrate.

公开(公告)号：US20240030954A1

公开(公告)日：2024-01-25

申请号：US18473310

申请日：2023-09-25

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takanori UEJIMA ,  Hiromichi KITAJIMA ,  Kiyoshi AIKAWA ,  Yoshihiro DAIMON ,  Takashi YAMADA

IPC: H04B1/38 ,  H03H9/25 ,  H01Q1/38 ,  H01Q1/22 ,  H01Q15/24

CPC classification number: H04B1/38 ,  H03H9/25 ,  H01Q1/38 ,  H01Q1/2283 ,  H01Q15/24 ,  H01Q1/2208

Abstract: A radio frequency module includes a module substrate that has main surfaces that face each other, a module substrate that has main surfaces that face each other. A first main surface faces a second main surface. Multiple electronic components are disposed between the main surfaces, on or along one main surface, and on or along another main surface. Multiple external connection terminals are disposed on or along one main surface and are joined to the module substrate and a motherboard. An absolute value of a difference between a thermal expansion coefficient of the module substrate and a thermal expansion coefficient of the motherboard is smaller than an absolute value of a difference between a thermal expansion coefficient of the module substrate and the thermal expansion coefficient of the motherboard.

公开(公告)号：US20200228067A1

公开(公告)日：2020-07-16

申请号：US16829776

申请日：2020-03-25

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takashi YAMADA ,  Yuuri HONDA ,  Satoshi TANAKA

IPC: H03F1/32 ,  H03F3/19 ,  H03F3/21 ,  H03F3/191 ,  H03F1/56 ,  H03F3/24

Abstract: A power amplifier circuit includes a power amplifier that amplifies an input signal and outputs the amplified signal from an output terminal thereof, a first filter circuit that has a frequency characteristic that attenuates an Nth-order harmonic of the amplified signal, N that is an integer greater than or equal to 2, and a second filter circuit that has a frequency characteristic that attenuates the Nth-order harmonic of the amplified signal. The first filter circuit includes a first capacitor and a first inductor. The first capacitor and the first inductor are connected in series between the output terminal and ground. The second filter circuit includes a second capacitor and a second inductor. The second capacitor and the second inductor are connected in series between the output terminal and ground.

公开(公告)号：US20240030165A1

公开(公告)日：2024-01-25

申请号：US18475231

申请日：2023-09-27

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kiyoshi AIKAWA ,  Hiromichi KITAJIMA ,  Takanori UEJIMA ,  Takashi YAMADA ,  Yoshihiro DAIMON

IPC: H01L23/66 ,  H01L23/00 ,  H01L25/065 ,  H01L23/498 ,  H01L23/552 ,  H03F3/213

CPC classification number: H01L23/66 ,  H01L24/16 ,  H01L25/0652 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/552 ,  H03F3/213 ,  H01L2223/6655 ,  H01L2223/6672 ,  H01L2224/16155 ,  H01L2224/16137 ,  H01L2924/1206 ,  H01L2924/1205 ,  H01L2924/14215 ,  H03F2200/294

Abstract: A high-frequency module includes a module substrate including major surfaces opposite to each other; a module substrate including major surfaces opposite to each other, the major surface being disposed facing the major surface; a first electronic component including a filter coupled to a power amplifier; a second electronic component including a filter coupled to a low-noise amplifier; and a third electronic component (an integrated circuit) including the low-noise amplifier. The first electronic component is disposed one of between the major surfaces, on the major surface, and on the major surface. The second electronic component is disposed another one of between the major surface surfaces, on the major surface, and on the major surface. The third electronic component is disposed other one of between the major surfaces, on the major surface, and on the major surface.

公开(公告)号：US20240022275A1

公开(公告)日：2024-01-18

申请号：US18475222

申请日：2023-09-27

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kiyoshi AIKAWA ,  Takanori UEJIMA ,  Hiromichi KITAJIMA ,  Takashi YAMADA ,  Yoshihiro DAIMON ,  Syuichi ONODERA ,  Yuudai TANOUE ,  Norihiro SHIMADA

IPC: H04B1/38 ,  H01Q1/22 ,  H03H9/25 ,  H03H7/38

CPC classification number: H04B1/38 ,  H01Q1/2283 ,  H03H9/25 ,  H03H7/38

Abstract: A radio-frequency module includes a module substrate having major surfaces opposite to each other; a module substrate having major surfaces opposite to each other, the major surface being disposed facing the major surface; a first electronic component disposed on the major surface; a second electronic component that includes a first electrode joined to the major surface and a second electrode joined to the major surface and that is disposed between the major surfaces; and a third electronic component disposed on the major surface; and an external connection terminal disposed on the major surface. The second electronic component is at least one of a chip inductor, a chip capacitor, and a chip resistor. The second electronic component is coupled via the first electrode to the first electronic component and is coupled via the second electrode to the third electronic component or external connection terminal.