Invention Publication
- Patent Title: POLYETHYLENE-BASED RESIN MULTILAYER FOAM SHEET AND METHOD FOR PRODUCING SAME
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Application No.: US18258874Application Date: 2021-10-01
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Publication No.: US20240042743A1Publication Date: 2024-02-08
- Inventor: Hirotoshi KAKUTA , Mikidai FUJITA , Naoya KATSUYAMA
- Applicant: JSP CORPORATION
- Applicant Address: JP Chiyoda-ku
- Assignee: JSP CORPORATION
- Current Assignee: JSP CORPORATION
- Current Assignee Address: JP Chiyoda-ku
- Priority: JP 20216578 2020.12.25
- International Application: PCT/JP2021/036370 2021.10.01
- Date entered country: 2023-06-22
- Main IPC: B32B27/06
- IPC: B32B27/06 ; B32B27/32 ; B32B27/30 ; B32B37/15 ; B32B5/18

Abstract:
A polyethylene-based resin multilayer foam sheet may include a polyethylene-based resin foam layer containing a polyethylene-based resin (A) as a base resin, and a conductive layer laminated on at least one side of the foam layer. The conductive layer contains: a mixed resin of one or more polyethylenes (B) of low-density polyethylenes and/or linear low-density polyethylenes and an ethylene-based copolymer (C) having a structural unit derived from ethylene and a structural unit derived from a monomer having a polar group; and conductive carbon. The conductive carbon blended in the conductive layer may be in a range of from 3 to 15 wt. %. The difference, TmB−TmC, between the melting point TmB of the polyethylene (B) and the melting point TmC of the ethylene-based copolymer (C) each contained in the conductive layer may be in a range of from 30 to 80° C.
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