Invention Publication
- Patent Title: LIQUID PROCESSING APPARATUS AND LIQUID PROCESSING METHOD
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Application No.: US18228905Application Date: 2023-08-01
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Publication No.: US20240047237A1Publication Date: 2024-02-08
- Inventor: Koki YOSHIMURA , Satoshi NAKAKIDO
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Priority: JP 22126419 2022.08.08
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/687

Abstract:
A liquid processing apparatus includes: a stage; a cup that surrounds a substrate placed on the stage; a processing liquid supplier that supplies a processing liquid to the substrate; an exhaust port provided in the cup to exhaust the cup; an annular body provided inside the cup to surround the substrate and form a flow path for a gas flowing into the cup; a lifting mechanism that raises or lowers the annular body relative to the cup to perform a switching between a first state in which the annular body is located at a first relative height to perform a first exhaust and a second state in which the annular body is located at a second relative height to perform a second exhaust; and a drainage port that opens to an upstream side of the exhaust port in each of the first and second flow paths.
Information query
IPC分类: