A method of manufacturing a semiconductor structure and a semiconductor structure are provided. The method includes: providing a sacrificial structure disposed on a substrate; arranging a photomask to cover the sacrificial structure, wherein the photomask includes a plurality of transparent portions, a plurality of central opaque portions, at least one first edge opaque portion and at least one second edge opaque portion between the first edge opaque portion and the central opaque portions; removing portions of the sacrificial structure to form a plurality of central openings, at least one first edge opening and at least one second edge opening through the central opaque portions, the first edge opaque portion, the second edge opaque portion and the transparent portions; and forming at least one edge word line on the substrate through the second edge opening and forming a plurality of central word lines on the substrate through the central openings.