• Patent Title: COATING TREATMENT APPARATUS, COATING TREATMENT METHOD, AND COMPUTER STORAGE MEDIUM
  • Application No.: US18260575
    Application Date: 2022-01-04
  • Publication No.: US20240050977A1
    Publication Date: 2024-02-15
  • Inventor: Shogo INABA
  • Applicant: Tokyo Electron Limited
  • Applicant Address: JP Tokyo
  • Assignee: Tokyo Electron Limited
  • Current Assignee: Tokyo Electron Limited
  • Current Assignee Address: JP Tokyo
  • Priority: JP 21003100 2021.01.12
  • International Application: PCT/JP2022/000015 2022.01.04
  • Date entered country: 2023-07-06
  • Main IPC: B05C11/10
  • IPC: B05C11/10 B05C11/08
COATING TREATMENT APPARATUS, COATING TREATMENT METHOD, AND COMPUTER STORAGE MEDIUM
Abstract:
A coating treatment apparatus for applying a coating solution to a peripheral portion of a substrate, includes: a holding and rotating part holding and rotating the substrate; a coating solution supply nozzle supplying the coating solution to the peripheral portion of the substrate; a moving mechanism moving the coating solution supply nozzle; and a controller controlling the holding and rotating part, coating solution supply nozzle, and moving mechanism, wherein the controller performs control of, while rotating the holding and rotating part: by controlling the moving mechanism while supplying the coating solution by the coating solution supply nozzle, both moving the coating solution supply nozzle from an outside of a perimeter of the substrate to a predetermined position at a periphery on the substrate at a first speed and then moving the coating solution supply nozzle from the predetermined position to the outside of the perimeter at a higher second speed.
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