公开(公告)号：US20220074053A1

公开(公告)日：2022-03-10

申请号：US17464926

申请日：2021-09-02

Applicant: Tokyo Electron Limited

Inventor： Shogo INABA ,  Masatoshi KAWAKITA

IPC: C23C18/20 ,  C23C18/16

Abstract: A substrate processing apparatus for forming a coating film on a peripheral edge portion including a peripheral edge of a front surface and a side surface of a substrate, includes: a substrate holder for rotatably holding the substrate; a first chemical liquid supplier for supplying a first chemical liquid onto the peripheral edge including a rear surface of the substrate; a partial removing part for removing the first chemical liquid adhering to at least a portion of the front and side surfaces; a second chemical liquid supplier for supplying a second chemical liquid for forming the coating film onto the front and side surfaces; a first chemical liquid removing part for removing the first chemical liquid remaining on the substrate to which the second chemical liquid adheres; and a controller for controlling the parts described above.

公开(公告)号：US20230407482A1

公开(公告)日：2023-12-21

申请号：US18239825

申请日：2023-08-30

Applicant: Tokyo Electron Limited

Inventor： Shogo INABA ,  Masatoshi KAWAKITA

IPC: C23C18/20 ,  C23C18/16 ,  B05C5/02

CPC classification number: C23C18/2033 ,  C23C18/2046 ,  C23C18/1692 ,  B05C5/0204 ,  B05C5/0216

Abstract: A substrate processing apparatus for forming a coating film on a peripheral edge portion including a peripheral edge of a front surface and a side surface of a substrate, includes: a substrate holder for rotatably holding the substrate; a first chemical liquid supplier for supplying a first chemical liquid onto the peripheral edge including a rear surface of the substrate; a partial removing part for removing the first chemical liquid adhering to at least a portion of the front and side surfaces; a second chemical liquid supplier for supplying a second chemical liquid for forming the coating film onto the front and side surfaces; a first chemical liquid removing part for removing the first chemical liquid remaining on the substrate to which the second chemical liquid adheres; and a controller for controlling the parts described above.

公开(公告)号：US20200234979A1

公开(公告)日：2020-07-23

申请号：US16735902

申请日：2020-01-07

Applicant: Tokyo Electron Limited

Inventor： Shogo INABA

IPC: H01L21/67 ,  B05C11/08 ,  B05D1/00 ,  G03F7/16 ,  H01L21/02

Abstract: A coating film forming method includes: rotating a substrate at a first rotation speed in a coating cup with an upper surface open, and supplying and diffusing a coating solution for forming a coating film on the substrate; and after the supplying and diffusing the coating solution, drying the substrate by exhausting air through a gap between an annular member arranged above the substrate with centers thereof being located on a same axis and the front surface of the substrate, while rotating the substrate at a second rotation speed lower than the first rotation speed, wherein at the drying the substrate, a flow velocity of the air exhausted through the gap is higher than a flow velocity of air supplied from above the substrate in the coating cup to the substrate.

公开(公告)号：US20240050977A1

公开(公告)日：2024-02-15

申请号：US18260575

申请日：2022-01-04

Applicant: Tokyo Electron Limited

Inventor： Shogo INABA

IPC: B05C11/10 ,  B05C11/08

CPC classification number: B05C11/10 ,  B05C11/08 ,  H01L21/6838

Abstract: A coating treatment apparatus for applying a coating solution to a peripheral portion of a substrate, includes: a holding and rotating part holding and rotating the substrate; a coating solution supply nozzle supplying the coating solution to the peripheral portion of the substrate; a moving mechanism moving the coating solution supply nozzle; and a controller controlling the holding and rotating part, coating solution supply nozzle, and moving mechanism, wherein the controller performs control of, while rotating the holding and rotating part: by controlling the moving mechanism while supplying the coating solution by the coating solution supply nozzle, both moving the coating solution supply nozzle from an outside of a perimeter of the substrate to a predetermined position at a periphery on the substrate at a first speed and then moving the coating solution supply nozzle from the predetermined position to the outside of the perimeter at a higher second speed.

公开(公告)号：US20200147637A1

公开(公告)日：2020-05-14

申请号：US16468356

申请日：2017-11-24

Applicant: Tokyo Electron Limited

Inventor： Shogo INABA ,  Kosuke YOSHIHARA ,  Shinichi HATAKEYAMA

IPC: B05C11/08 ,  B05C5/02 ,  B05D1/36 ,  B05D3/12

Abstract: A method for coating a top of a substrate with a coating solution, the method includes: supplying, before a solution film of the coating solution formed on the substrate dries, a solvent for the coating solution to a peripheral portion on the solution film of the coating solution on the substrate while rotating the substrate at a predetermined rotation speed to form a mixed layer of the coating solution and the solvent at the peripheral portion; and then, controlling a film thickness of the coating solution after drying by rotating the substrate at a rotation speed higher than the predetermined rotation speed to push the mixed layer to an outer peripheral side.