Invention Publication
- Patent Title: ELECTRICALLY CONDUCTIVE ADHESIVE, SINTERED BODY OF ELECTRICALLY CONDUCTIVE ADHESIVE, METHOD FOR PRODUCING SINTERED BODY, ELECTRONIC COMPONENT, AND METHOD FOR PRODUCING ELECTRONIC COMPONENT
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Application No.: US18546658Application Date: 2022-02-14
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Publication No.: US20240052213A1Publication Date: 2024-02-15
- Inventor: Hideya KAWASAKI , Suguru HASHIDATE , Ryo KATOU , Takamichi MORI , Junichiro MINAMI
- Applicant: THE SCHOOL CORPORATION KANSAI UNIVERSITY , OSAKA SODA CO., LTD.
- Applicant Address: JP Suita-shi, Osaka
- Assignee: THE SCHOOL CORPORATION KANSAI UNIVERSITY,OSAKA SODA CO., LTD.
- Current Assignee: THE SCHOOL CORPORATION KANSAI UNIVERSITY,OSAKA SODA CO., LTD.
- Current Assignee Address: JP Suita-shi, Osaka
- Priority: JP 21024327 2021.02.18
- International Application: PCT/JP2022/005713 2022.02.14
- Date entered country: 2023-08-16
- Main IPC: C09J9/02
- IPC: C09J9/02 ; C09J11/04 ; C09J163/00
Abstract:
Provided is a novel electrically conductive adhesive which can yield a sintered body having low resistivity despite containing a thermosetting resin in addition to silver particles. This electrically conductive adhesive contains silver particles and a thermosetting resin. The silver particles are provided with a protective layer that contains a compound represented by general formula (1).
[In general formula (1), R1 is an alkyl group having 1-5 carbon atoms, and R2 is a hydrogen atom or an alkyl group having 1-5 carbon atoms.]
[In general formula (1), R1 is an alkyl group having 1-5 carbon atoms, and R2 is a hydrogen atom or an alkyl group having 1-5 carbon atoms.]
Information query
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