Invention Publication
- Patent Title: ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMING METHOD, AND METHOD FOR PRODUCING ELECTRONIC DEVICE
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Application No.: US18362376Application Date: 2023-07-31
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Publication No.: US20240053679A1Publication Date: 2024-02-15
- Inventor: Takamitsu TOMIGA , Sou KAMIMURA , Yoichi NISHIDA , Hideaki TSUBAKI
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Priority: JP 22122920 2022.08.01 JP 23043552 2023.03.17
- Main IPC: G03F7/039
- IPC: G03F7/039 ; G03F7/004 ; G03F7/20
Abstract:
An actinic ray-sensitive or radiation-sensitive resin composition including a resin (A) undergoing an increase in alkali solubility due to action of acid; a compound (C) generating acid upon irradiation with an actinic ray or radiation; and a solvent (S) including a solvent SA having a boiling point of 130° C. to 150° C. and a solvent SB having a boiling point of 155° C. to 250° C., in which a content of the solvent SA is higher than a content of the solvent SB, the content of the solvent SB relative to the whole solvent is 1% to 30% by mass, and a concentration of solid contents is 10% by mass or more.
Information query
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