Invention Publication
- Patent Title: SEQUENTIAL WRITE OPERATIONS USING MULTIPLE MEMORY DIES
-
Application No.: US17884422Application Date: 2022-08-09
-
Publication No.: US20240053900A1Publication Date: 2024-02-15
- Inventor: Rakeshkumar Dayabhai Vaghasiya , Anilkumar Rameshbhai Sindhi
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Main IPC: G06F3/06
- IPC: G06F3/06

Abstract:
Methods, systems, and devices for sequential write operations using multiple memory dies are described. A memory system may be configured to support write operations that include writing respective subsets of a sequence of data to each first memory die of a set of multiple first memory dies, and then writing the sequence of data to a second memory die (e.g., based on reading the respective subsets of the sequence of data from the set of first memory dies). In some examples, such techniques may be implemented with memory dies having different memory cell storage densities. For example, the set of multiple first memory dies may be operated in accordance with relatively lower storage densities to leverage relatively faster access operations, whereas the second memory die may be operated in accordance with a relatively higher storage density to leverage relatively higher capacity.
Public/Granted literature
- US12248681B2 Sequential write operations using multiple memory dies Public/Granted day:2025-03-11
Information query