Invention Publication
- Patent Title: SMALL OUTLINE TRANSISTOR WITH THERMAL FLAT LEAD
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Application No.: US17887790Application Date: 2022-08-15
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Publication No.: US20240055331A1Publication Date: 2024-02-15
- Inventor: Hau Nguyen , Ashok Prabhu , Kurt Sincerbox
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/00 ; H01L23/31 ; H01L21/48 ; H01L21/56

Abstract:
An electronic device includes a die attach pad, a semiconductor die, a lead, a package structure, and tie bars, where the die attach pad has opposite first and second sides, the semiconductor die is attached to the second side of the die attach pad, the lead has a first portion connected to a circuit of the semiconductor die by a bond wire, the package structure exposes a portion of the first side of the die attach pad and the second portion of the lead. Four tie bars extend outward from the die attach pad and the tie bars have respective ends exposed outside the package structure.
Information query
IPC分类: